Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

Abstract: An apparatus and method for measurement of a signal with a monitor gate is disclosed. A signal to be measured is applied as an input to the monitor gate and a detection signal is generated that indicates whether or not the monitor gate has switched between states. A digital output is generated that corresponds to the integration of the detection signal. The output of the digital integrator is applied to a digital-to-analog converter. The output of the digital-to-analog converter is fed back to the monitor gate. A probability limit monitor and a gain control with respect to signal measurement are also disclosed.