Abstract: Systems and methods for shaping leads of electronic lapping guides to reduce calibration error are provided. One such system includes a device configured to generate predictable resistance for leads of an electronic lapping guide, the device including a lapping surface, and an ELG configured to provide information indicative of a degree of lapping performed on the lapping surface, the ELG including a first electrical lead, a second electrical lead spaced apart from the first electrical lead, and a resistive element between the first electrical lead and the second electrical lead, the resistive element including a right segment, a left segment, and a middle segment that abuts each of the right segment and the left segment, where the right segment is spaced apart from the left segment and the middle segment is adjacent to the lapping surface, where the first and second electrical leads are recessed from the middle segment.

Abstract: A system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.

Abstract: A method and system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.

Abstract: A method for modeling devices in a wafer comprises the step of providing the wafer comprising a first plurality of devices having a track width and a first stripe height, a second plurality of devices having the track width and a second stripe height, and a third plurality of devices having the track width and a third stripe height. The method further comprises the steps of measuring resistance values for the first, second and third plurality of devices to obtain a data set correlating a stripe height and a resistance value for each of the first, second and third plurality of devices, and estimating a linear relationship between resistance and inverse stripe height for the first, second and third plurality of devices based on the data set.