Patents by Inventor Eric Rieder

Eric Rieder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181278
    Abstract: There is provided an apodizing wedge structure for a LIPUS treatment head. The LIPUS treatment head includes a low-volume fraction piezoelectric composite disc. The apodizing wedge structure includes an annular body for contacting a surface of the piezoelectric disc, the annular body including an inner perimeter having an inner thickness and an outer perimeter having an outer thickness. The annular body includes an inclined surface forming a continuous slope extending from the inner perimeter to the outer perimeter, the inner thickness being smaller than the outer thickness. The apodizing wedge is configured to change an apparent thickness of the piezoelectric disc with respect to resonant properties of the piezoelectric disc when the apodizing wedge structure is in acoustic communication with the piezoelectric disc, thereby allowing the LIPUS treatment head to generate a uniform near field. LIPUS treatment heads and ultrasonic transducers including such an apodizing wedge structure are also provided.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 6, 2024
    Inventors: Nicholas Chris CHAGGARES, Khachic Chris KARSHAFIAN, Eric RIEDER
  • Publication number: 20240017294
    Abstract: There is provided an ultrasonic transducer having a sample-contacting portion and a back portion, the back portion being opposed to the sample contacting portion. The transducer includes a piezoelectric material configured to be in acoustic communication with a sample and a backing structure in acoustic communication with the piezoelectric material. The backing structure is configured to reflect acoustic energy towards the sample-contacting portion and away from the back portion of the ultrasonic transducer. The backing structure includes a low acoustic impedance layer and a high acoustic impedance layer. The transducer may also include a second dual layer de-matching backing. The second dual layer de-matching backing includes a second low acoustic impedance layer and a second high acoustic impedance layer.
    Type: Application
    Filed: November 17, 2020
    Publication date: January 18, 2024
    Applicant: RESONANT ACOUSTICS INTERNATIONAL INC.
    Inventors: Nicholas Chris CHAGGARES, Varak KALIAN, Eric RIEDER
  • Patent number: 11845108
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: December 19, 2023
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Publication number: 20200222941
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 16, 2020
    Applicant: FUJIFILM SONOSITE, INC.
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Patent number: 10596597
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: March 24, 2020
    Assignee: Fujifilm Sonosite, Inc.
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Patent number: 9907538
    Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: March 6, 2018
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: Nicholas Christopher Chaggares, Eric Rieder
  • Publication number: 20170224306
    Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.
    Type: Application
    Filed: February 23, 2017
    Publication date: August 10, 2017
    Inventors: Nicholas Christopher Chaggares, Eric Rieder
  • Publication number: 20170197232
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Application
    Filed: January 27, 2017
    Publication date: July 13, 2017
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Patent number: 9603580
    Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: March 28, 2017
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: Nicholas Christopher Chaggares, Eric Rieder
  • Patent number: 9555443
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: January 31, 2017
    Assignee: FUJIFILM SonoSite, Inc.
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Publication number: 20160107193
    Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
    Type: Application
    Filed: October 26, 2015
    Publication date: April 21, 2016
    Inventors: N. Christopher Chaggares, Eric Rieder
  • Publication number: 20140350407
    Abstract: A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.
    Type: Application
    Filed: May 23, 2014
    Publication date: November 27, 2014
    Applicant: FUJIFILM SONOSITE, INC.
    Inventors: Nicholas Christopher Chaggares, Eric Rieder