Patents by Inventor Eric S. Gray

Eric S. Gray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High directivity ultra-compact coupler
    Patent number: 7564325
    Abstract: A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: July 21, 2009
    Assignee: Fairchiled Semiconductor Corporation
    Inventors: Abid Hussain, Daniel J. Donoghue, Eric S. Gray
  • SYSTEM INCLUDING A HIGH DIRECTIVITY ULTRA-COMPACT COUPLER
    Publication number: 20080197938
    Abstract: A system with an RFin terminal and an RFout terminal includes an output matching network. The system further includes a coupler having a thru arm connected between the output matching network and the RFout terminal, and a coupled arm connected to a detector circuit. The coupler further includes a stack of first and second dielectric materials having different dielectric constants. The stack of first and second dielectric materials extends over a top surface of a substrate. The thru arm and the coupled arm extend over the stack of first and second dielectric materials in the same plane parallel to a surface of the substrate.
    Type: Application
    Filed: May 10, 2007
    Publication date: August 21, 2008
    Inventors: Abid Hussain, Daniel J. Donoghue, Eric S. Gray
  • High Directivity Ultra-Compact Coupler
    Publication number: 20080197937
    Abstract: A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.
    Type: Application
    Filed: February 15, 2007
    Publication date: August 21, 2008
    Inventors: Abid Hussain, Daniel J. Donoghue, Eric S. Gray
  • System including a high directivity ultra-compact coupler
    Patent number: 7414493
    Abstract: A system with an RFin terminal and an RFout terminal includes an output matching network. The system further includes a coupler having a thru arm connected between the output matching network and the RFout terminal, and a coupled arm connected to a detector circuit. The coupler further includes a stack of first and second dielectric materials having different dielectric constants. The stack of first and second dielectric materials extends over a top surface of a substrate. The thru arm and the coupled arm extend over the stack of first and second dielectric materials in the same plane parallel to a surface of the substrate.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: August 19, 2008
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Abid Hussain, Daniel J. Donoghue, Eric S. Gray