Patents by Inventor Eric S. Li
Eric S. Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957893Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.Type: GrantFiled: August 25, 2020Date of Patent: April 16, 2024Assignee: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde, David A. Dinsmoor, Duane L. Bourget, Forrest C M Pape, Gabriela C. Molnar, Joel A. Anderson, Michael J. Ebert, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Timothy J. Denison, Todd V. Smith
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Patent number: 11957894Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.Type: GrantFiled: August 25, 2020Date of Patent: April 16, 2024Assignee: Medtronic, Inc.Inventors: Anthony M. Chasensky, Bernard Q. Li, Brad C. Tischendorf, Chris J. Paidosh, Christian S. Nielsen, Craig L. Schmidt, David A. Dinsmoor, Duane L. Bourget, Eric H. Bonde, Erik R. Scott, Forrest C M Pape, Gabriela C. Molnar, Gordon O. Munns, Joel A. Anderson, John E. Kast, Joseph J. Viavattine, Markus W. Reiterer, Michael J. Ebert, Phillip C. Falkner, Prabhakar A. Tamirisa, Randy S. Roles, Reginald D. Robinson, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Thomas P. Miltich, Timothy J. Denison, Todd V. Smith, Xuan K. Wei
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Patent number: 10892535Abstract: A method for a vertical transition between a coaxial structure and a microstrip line features a slot in the ground plane of the microstrip line and near one end of its signal line. Multiple through holes are created at the substrate within the slot. The multiple through holes include a transition hole next to the end of the signal line, and at least a second hole. The transition hole and the slot are managed to establish a first eccentric configuration to achieve field transformation between the coaxial structure and the microstrip line, which would reduce the insertion loss of the vertical transition at higher frequencies and increase its 1-dB passband. The second hole and the slot are arranged to create a second eccentric configuration, and the second hole is used to relocate a resonance response caused by the slot towards higher frequencies to further increase the 1-dB passband.Type: GrantFiled: April 29, 2019Date of Patent: January 12, 2021Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventor: Eric S. Li
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Patent number: 10811756Abstract: A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector is attenuated or eliminated from the frequency response.Type: GrantFiled: May 10, 2017Date of Patent: October 20, 2020Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Eric S. Li, Hung-Yi Wu, Wen-Shuo Tsai
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Publication number: 20190341666Abstract: A method for a vertical transition between a coaxial structure and a microstrip line features a slot in the ground plane of the microstrip line and near one end of its signal line. Multiple through holes are created at the substrate within the slot. The multiple through holes include a transition hole next to the end of the signal line, and at least a second hole. The transition hole and the slot are managed to establish a first eccentric configuration to achieve field transformation between the coaxial structure and the microstrip line, which would reduce the insertion loss of the vertical transition at higher frequencies and increase its 1-dB passband. The second hole and the slot are arranged to create a second eccentric configuration, and the second hole is used to relocate a resonance response caused by the slot towards higher frequencies to further increase the 1-dB passband.Type: ApplicationFiled: April 29, 2019Publication date: November 7, 2019Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventor: Eric S. LI
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Patent number: 10116031Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.Type: GrantFiled: June 7, 2016Date of Patent: October 30, 2018Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Eric S. Li, Hong-Wei Huang
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Publication number: 20170352937Abstract: A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector can be attenuated or even eliminated from the frequency response. Thus, the method improves the insertion loss of the transition at high frequencies, and increases its 1-dB passband. Note that the signal line of the microstrip line is not inserted into the through hole of the metallic ring in the final assembly of the transition.Type: ApplicationFiled: May 10, 2017Publication date: December 7, 2017Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Eric S. LI, Hung-Yi WU, Wen-Shuo TSAI
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Publication number: 20160365684Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant is response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.Type: ApplicationFiled: June 7, 2016Publication date: December 15, 2016Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Eric S. LI, Hong-Wei HUANG
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Publication number: 20130147575Abstract: A bonding structure is applied to electrically connect a chip and a circuit board, such as a micro-strip line, for signal transmission between each other. The bonding structure includes a metallic plate and a capacitor. The chip and the micro-strip line are placed on the metallic plate but do not overlap or contact with each other. In particular, the capacitor is used to connect a signal pad of the chip and a signal line of the micro-strip line for signal transmission at high frequencies.Type: ApplicationFiled: September 12, 2012Publication date: June 13, 2013Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Eric S. LI, Yu-Shao Shiao, Tzi-Hong Chiueh, Shu-Yang Chen
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Patent number: 8384492Abstract: A connector comprises a coaxial connector and a metallic plate. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The metallic plate has a through hole and is attached to the mounting wall of the coaxial connector. The outside center conductor of the coaxial connector is placed within the through hole. Hence, the connector improves the transmission passband of the transition between a coaxial line and a microstrip line at high frequencies.Type: GrantFiled: September 7, 2010Date of Patent: February 26, 2013Assignee: National Taipei University of TechnologyInventors: Jui-Ching Cheng, Eric S. Li, Wen-Fu Chou, Kuan-Lin Huang
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Publication number: 20120088402Abstract: A connector comprises a coaxial connector and two metallic blocks. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors of the coaxial connector is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The two metallic blocks are split from a metallic plate with a circular through hole in the center by milling across the plate at a proper position. Both metallic blocks are attached to the mounting wall of the coaxial connector with the extended center conductor placed in the center of the original through hole and surrounded by the recesses of the two blocks. Hence, the connector improves the transmission passband of a transition between a coaxial cable and a microstrip line at high frequencies.Type: ApplicationFiled: April 28, 2011Publication date: April 12, 2012Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: ERIC S. LI, JUI-CHING CHENG, WEI-YU TAI
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Patent number: 8152534Abstract: A connector comprises a coaxial connector and two metallic blocks. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors of the coaxial connector is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The two metallic blocks are split from a metallic plate with a circular through hole in the center by milling across the plate at a proper position. Both metallic blocks are attached to the mounting wall of the coaxial connector with the extended center conductor placed in the center of the original through hole and surrounded by the recesses of the two blocks. Hence, the connector improves the transmission passband of a transition between a coaxial cable and a microstrip line at high frequencies.Type: GrantFiled: April 28, 2011Date of Patent: April 10, 2012Assignee: National Taipei University of TechnologyInventors: Eric S. Li, Jui-Ching Cheng, Wei-Yu Tai
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Publication number: 20120056696Abstract: A connector comprises a coaxial connector and a metallic plate. The coaxial connector has an outer conductor, a dielectric material, a mounting wall, and a center conductor. The space between the two conductors is filled with the dielectric material. The center conductor is extended from the inside of the coaxial connector to the other side of the mounting wall. The metallic plate has a through hole and is attached to the mounting wall of the coaxial connector. The outside center conductor of the coaxial connector is placed within the through hole. Hence, the connector improves the transmission passband of the transition between a coaxial line and a microstrip line at high frequencies.Type: ApplicationFiled: September 7, 2010Publication date: March 8, 2012Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: JUI-CHING CHENG, ERIC S. LI, WEN-FU CHOU, KUAN-LIN HUANG