Abstract: A method of manufacturing a solid oxide fuel cell stack having an electrically conductive interconnect, including the steps of: (a) providing a first fuel cell and a second fuel cell, (b) providing a substrate having an iron-chromium alloy, (c) depositing a layer of metallic cobalt over a portion of substrate surface, (d) subjecting the layer of metallic cobalt to reducing conditions, (e) then exposing the remaining portion of the layer of metallic cobalt to oxidizing conditions for a predetermined time and temperature, such that the surface portion of the layer of metallic cobalt is oxidized to cobalt oxide, thereby forming the electrically conductive interconnect having a layer of metallic cobalt sandwiched between a surface layer of cobalt oxide and the layer of cobalt-iron-chromium alloy, and (f) sandwiching the substrate between the first and second fuel cells.

Abstract: A method of manufacturing a solid oxide fuel cell stack having an electrically conductive interconnect, including the steps of: (a) providing a first fuel cell and a second fuel cell, (b) providing a substrate having an iron-chromium alloy, (c) depositing a layer of metallic cobalt over a portion of substrate surface, (d) subjecting the layer of metallic cobalt to reducing conditions, (e) then exposing the remaining portion of the layer of metallic cobalt to oxidizing conditions for a predetermined time and temperature, such that the surface portion of the layer of metallic cobalt is oxidized to cobalt oxide, thereby forming the electrically conductive interconnect having a layer of metallic cobalt sandwiched between a surface layer of cobalt oxide and the layer of cobalt-iron-chromium alloy, and (f) sandwiching the substrate between the first and second fuel cells.

Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Abstract: An edge-sealed, encapsulated environmentally sensitive device. The device includes an environmentally sensitive device, and at least one edge-sealed barrier stack. The edge-sealed barrier stack includes a decoupling layer and at least two barrier layers. The environmentally sensitive device is sealed between an edge-sealed barrier stack and either a substrate or another edge-sealed barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

Abstract: An edge-sealed, encapsulated environmentally sensitive device. The device includes an environmentally sensitive device, and at least one edge-sealed barrier stack. The edge-sealed barrier stack includes a decoupling layer and at least two barrier layers. The environmentally sensitive device is sealed between an edge-sealed barrier stack and either a substrate or another edge-sealed barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

Abstract: A method of making an edge-sealed, encapsulated environmentally sensitive device. The method includes providing an environmentally sensitive device on a substrate; depositing a decoupling layer through one mask, the decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device; increasing the distance between the one mask and the substrate; and depositing a first barrier layer through the one mask, the first barrier layer adjacent to the decoupling layer, the first barrier layer having an area greater than the discrete area of the decoupling layer and covering the decoupling layer, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer.

Abstract: Methods of making an edge-sealed, encapsulated environmentally sensitive device. One method includes providing an environmentally sensitive device with a contact on a substrate; depositing a decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device and not covering the contact, the decoupling layer deposited using a printing process; depositing a first barrier layer adjacent to the decoupling layer, the first barrier layer having a first area greater than the discrete area of the decoupling layer, and the first barrier layer having a second area covering the decoupling layer and the contact, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer; and removing the second area of the first barrier layer from the contact.

Abstract: An edge-sealed, encapsulated environmentally sensitive device. The device includes at least one initial barrier stack, an environmentally sensitive device, and at least one additional barrier stack. The barrier stacks include at least one decoupling layer and at least one barrier layer. The environmentally sensitive device is sealed between the at least one initial barrier stack and the at least one additional barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

Abstract: A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Abstract: A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Abstract: A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Abstract: An encapsulated organic light emitting device. The device may include a substrate, an organic light emitting layer stack adjacent to the substrate, and at least one first barrier stack adjacent to the organic light emitting device, the at least one first barrier stack comprising at least one first barrier layer and at least one first decoupling layer wherein the at least one first barrier stack encapsulates the organic light emitting device. There may be a second barrier stack adjacent to the substrate and located between the substrate and the organic light emitting device. The second barrier stack has at least one second barrier layer and at least one second decoupling layer. A method of making the encapsulated organic light emitting device is also provided.

Abstract: An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Abstract: A high temperature substrate having improved properties. The substrate is a polymer substrate having a glass transition temperature greater than about 120° C., and at least one first barrier stack adjacent to the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer. A method for making the high temperature substrate with improved properties is also disclosed.

Abstract: A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Abstract: An encapsulated organic light emitting device. The device may include a substrate, an organic light emitting layer stack adjacent to the substrate, and at least one first barrier stack adjacent to the organic light emitting device, the at least one first barrier stack comprising at least one first barrier layer and at least one first decoupling layer wherein the at least one first barrier stack encapsulates the organic light emitting device. There may be a second barrier stack adjacent to the substrate and located between the substrate and the organic light emitting device. The second barrier stack has at least one second barrier layer and at least one second decoupling layer. A method of making the encapsulated organic light emitting device is also provided.

Abstract: A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.