Abstract: Protective blankets comprise a flexible blanket body and a voltage supply. The flexible blanket body comprises a plurality of sheets of material operatively coupled together to define the flexible blanket body. The plurality of sheets comprises one or more sheets composed at least in part of a carbon nanotube material and at least one sheet composed of a different material. The voltage supply is electrically coupled at least to a first sheet of the one or more sheets composed at least in part of the carbon nanotube material, such that the first sheet defines a resistive heater.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: Protective blankets comprise a flexible blanket body and a voltage supply. The flexible blanket body comprises a plurality of sheets of material operatively coupled together to define the flexible blanket body. The plurality of sheets comprises one or more sheets composed at least in part of a carbon nanotube material and at least one sheet composed of a different material. The voltage supply is electrically coupled at least to a first sheet of the one or more sheets composed at least in part of the carbon nanotube material, such that the first sheet defines a resistive heater.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: Protective blankets include a plurality of sheets of material operatively coupled together to define the protective blanket. The plurality of sheets includes at least one sheet composed of carbon nanotube reinforced composite material and at least one sheet composed of a different material. Methods of assembling protective blankets include layering the plurality of sheets and operatively coupling together the plurality of sheets. Spacecraft include a body and a protective blanket operatively coupled to the body. Methods of assembling spacecraft include coupling a protective blanket to the body of a spacecraft.

Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

Abstract: Protective blankets include a plurality of sheets of material operatively coupled together to define the protective blanket. The plurality of sheets includes at least one sheet composed of carbon nanotube reinforced composite material and at least one sheet composed of a different material. Methods of assembling protective blankets include layering the plurality of sheets and operatively coupling together the plurality of sheets. Spacecraft include a body and a protective blanket operatively coupled to the body. Methods of assembling spacecraft include coupling a protective blanket to the body of a spacecraft.

Abstract: An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate to an external heatsink. The top of a flip chip die (e.g. a ceramic column grid array flip chip) may be enclosed with a metallic cover. The metallic cover is sealed to an outer frame, which in turn is sealed to metallization on the top of the flip chip through a flexure, minimizing mechanical load imparted to the flip chip. This forms a hermetic cavity enclosing the die. This hermetic cavity is partially filled with an inert non conductive fluid, which vaporizes when heated. Condensation occurs on the inner surface of the metal cover where the heat may be conducted into the outer frame for removal (e.g. rejection from the spacecraft).

Abstract: An apparatus and method for cooling electronics is disclosed. An encapsulated inert non-conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate to an external heatsink. The top of a flip chip die (e.g. a ceramic column grid array flip chip) may be enclosed with a metallic cover. The metallic cover is sealed to an outer frame, which in turn is sealed to metallization on the top of the flip chip through a flexure, minimizing mechanical load imparted to the flip chip. This forms a hermetic cavity enclosing the die. This hermetic cavity is partially filled with an inert non conductive fluid, which vaporizes when heated. Condensation occurs on the inner surface of the metal cover where the heat may be conducted into the outer frame for removal (e.g. rejection from the spacecraft).