Abstract: A high-resolution additive manufacturing system based on a parallel printing method using a spatial light modulator. A method and system for additive manufacturing using a DMD in the laser beam path. The use of a pre-heat laser beam in combination with a build laser beam having a DMD along the build laser beam path.

Abstract: A communication system is provided. The communication system includes a serialized radio frequency transceiver module and at least one radio frequency module. The serialized radio frequency transceiver module includes a plurality of optical-module connectors, and a remote serialized radio frequency interface including a plurality of high speed connectors. Each of the at least one radio frequency module includes an interface configured to be coupled to the remote serialized radio frequency interface of the serialized radio frequency transceiver module to pass and receive data signals, and a remote digital-analog radio transceiver input interface coupled to the interface. The remote digital-analog radio transceiver input interface is configured to pass data signals to and from the at least one radio frequency module.

Abstract: An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing.

Abstract: An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing.

Abstract: A clamping system is disclosed that includes at least one rigid clamp member. The rigid clamp member has an angled surface operable to hold a structure against a mounting surface, and the rigid clamp member is configured to be attached to the mounting surface. The clamping system also includes at least one adjustable clamp member. The adjustable clamp member has an angled adjustable surface operable to hold the structure against the mounting surface. Additionally, the adjustable clamp member is configured to be attached to the mounting surface.