Patents by Inventor Eric S. Snyder

Eric S. Snyder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • On-clip high frequency reliability and failure test structures
    Patent number: 5625288
    Abstract: Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: April 29, 1997
    Assignee: Sandia Corporation
    Inventors: Eric S. Snyder, David V. Campbell