Patents by Inventor Eric Sabouret
Eric Sabouret has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11908809Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.Type: GrantFiled: May 20, 2021Date of Patent: February 20, 2024Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SASInventors: Eric Sabouret, Krysten Rochereau, Olivier Hinsinger, Flore Persin-Crelerot
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Publication number: 20210272915Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.Type: ApplicationFiled: May 20, 2021Publication date: September 2, 2021Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SASInventors: Eric SABOURET, Krysten ROCHEREAU, Olivier HINSINGER, Flore PERSIN-CRELEROT
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Patent number: 11018096Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.Type: GrantFiled: December 5, 2018Date of Patent: May 25, 2021Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SASInventors: Eric Sabouret, Krysten Rochereau, Olivier Hinsinger, Flore Persin-Crelerot
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Publication number: 20190172795Abstract: An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.Type: ApplicationFiled: December 5, 2018Publication date: June 6, 2019Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SASInventors: Eric SABOURET, Krysten ROCHEREAU, Olivier HINSINGER, Flore PERSIN-CRELEROT
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Patent number: 8981551Abstract: A semiconductor device may include at least one pad adjacent a top surface of the device, and a metal crack stop structure below the at least one pad. The metal crack structure may have an inner envelope and an outer envelope, and may be configured to be vertically aligned with the at least one pad so that an edge of the at least one pad is between the inner and outer envelopes.Type: GrantFiled: September 20, 2013Date of Patent: March 17, 2015Assignee: STMicroelectronics (Crolles 2) SASInventors: Philippe Delpech, Eric Sabouret, Sebastien Gallois-Garreignot
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Publication number: 20140091451Abstract: A semiconductor device may include at least one pad adjacent a top surface of the device, and a metal crack stop structure below the at least one pad. The metal crack structure may have an inner envelope and an outer envelope, and may be configured to be vertically aligned with the at least one pad so that an edge of the at least one pad is between the inner and outer envelopes.Type: ApplicationFiled: September 20, 2013Publication date: April 3, 2014Applicant: STMicroelectronics (Crolles 2) SASInventors: Philippe Delpech, Eric Sabouret, Sebastien Gallois-Garreignot
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Patent number: 8193530Abstract: An integrated-circuit semiconductor device includes external electrical connection pads on one face and electrical connection vias under said pads. The electrical connection vias are arranged with a defined pitch in a defined direction. Each via is respectively associated with one of a plurality of adjacent zones of the face. These zones extend perpendicularly to the pitch direction. The electrical connection pads are grouped in adjacent pairs. An insulation space is located between the pads of each pair of electrical connection pads. In a direction perpendicular to the pitch direction, the pads in the pair are spaced apart. The pads of each pair of electrical connection pads extend over a pair of adjacent zones and are associated with two adjacent vias.Type: GrantFiled: August 11, 2009Date of Patent: June 5, 2012Assignees: STMicroelectronics S.A., STMicroelectronics (Crolles 2) SASInventors: Eric Sabouret, Laurent Hoareau, Yves Salmon
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Publication number: 20110272801Abstract: A semiconductor device includes an integrated circuit and external electrical connection pads. Each pad includes cavities that are at least partially filled with a material different from the material forming the pads, so as to form inserts.Type: ApplicationFiled: May 4, 2011Publication date: November 10, 2011Applicants: STMICROELECTRONICS S.A., STMICROELECTRONICS (CROLLES 2) SASInventors: Vincent Fiori, Philippe Delpech, Eric Sabouret
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Publication number: 20100044886Abstract: An integrated-circuit semiconductor device includes external electrical connection pads on one face and electrical connection vias under said pads. The electrical connection vias are arranged with a defined pitch in a defined direction. Each via is respectively associated with one of a plurality of adjacent zones of the face. These zones extend perpendicularly to the pitch direction. The electrical connection pads are grouped in adjacent pairs. An insulation space is located between the pads of each pair of electrical connection pads. In a direction perpendicular to the pitch direction, the pads in the pair are spaced apart. The pads of each pair of electrical connection pads extend over a pair of adjacent zones and are associated with two adjacent vias.Type: ApplicationFiled: August 11, 2009Publication date: February 25, 2010Applicants: STMicroelectronics S.A., STMicroelectronics (Crolles 2) SASInventors: Eric Sabouret, Laurent Hoareau, Yves Salmon
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Patent number: 6822329Abstract: Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.Type: GrantFiled: May 14, 2002Date of Patent: November 23, 2004Assignee: STMicroelectronics SAInventors: Michel Varrot, Guillaume Bouche, Roberto Gonella, Eric Sabouret
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Publication number: 20020179991Abstract: Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.Type: ApplicationFiled: May 14, 2002Publication date: December 5, 2002Applicant: STMicroelectronics S.A.Inventors: Michel Varrot, Guillaume Bouche, Roberto Gonella, Eric Sabouret