Patents by Inventor Eric Salvas

Eric Salvas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal interface material on package
    Patent number: 10896862
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: January 19, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20180190565
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9941184
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: April 10, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20180047655
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: October 24, 2017
    Publication date: February 15, 2018
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • Thermal interface material on package
    Patent number: 9881848
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: January 30, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9761505
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: September 12, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9646913
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: May 9, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9576878
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: February 21, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20160042976
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20160043016
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20160043015
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20160042977
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • Thermal interface material on package
    Patent number: 9257308
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 9, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9257307
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 9, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9252121
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: February 2, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • Thermal interface material on package
    Patent number: 9252029
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 2, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20150364343
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20150364342
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20150364341
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: August 26, 2015
    Publication date: December 17, 2015
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
  • THERMAL INTERFACE MATERIAL ON PACKAGE
    Publication number: 20150206851
    Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 23, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON