Patents by Inventor Eric Snow

Eric Snow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216158
    Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: February 4, 2025
    Assignee: Intel Corporation
    Inventors: Jeremy Hicks, Hari Mahalingam, Christopher Seibert, Eric Snow, Harel Frish
  • Publication number: 20220163583
    Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 26, 2022
    Applicant: Intel Corporation
    Inventors: Jeremy Hicks, Hari Mahalingam, Christopher Seibert, Eric Snow, Harel Frish
  • Publication number: 20060249402
    Abstract: A sensing device having: a bottom electrode, a dielectric on the bottom electrode, a grid of nanoelectrodes on the dielectric, and a top electrode in electrical contact with the grid. A method of chemical or biological sensing comprising: providing a grid of nanoelectrodes; exposing the grid to fluid suspected of containing a chemical or biological analyte; and measuring a change in the capacitance and conductance of the grid.
    Type: Application
    Filed: September 27, 2005
    Publication date: November 9, 2006
    Inventors: Eric Snow, F. Keith Perkins, Eric Houser, Stan Stepnowski, R. McGill