Abstract: A method for monitoring a fleet comprising a plurality of measurement tools includes collecting data for a current time interval from the fleet by a data collection module; and performing fleet measurement precision (FMP)/tool matching precision (TMP) analysis on the collected data by a FMP/TMP analysis module, wherein FMP/TMP analysis comprises determining a TMP for each of the plurality of measurement tools using a static and a dynamic benchmark measuring system (BMS); and determining a FMP for the fleet using the static and the dynamic BMS; and determining if the FMP is above a predetermined threshold by a fleet improvement module, and in the event the FMP is above the predetermined threshold, identifying at least one tool of the plurality of tools as poorly performing based on the TMPs; and flagging the identified at least one tool for improvement.

Abstract: A method for monitoring a fleet comprising a plurality of measurement tools includes collecting data for a current time interval from the fleet by a data collection module; and performing fleet measurement precision (FMP)/tool matching precision (TMP) analysis on the collected data by a FMP/TMP analysis module, wherein FMP/TMP analysis comprises determining a TMP for each of the plurality of measurement tools using a static and a dynamic benchmark measuring system (BMS); and determining a FMP for the fleet using the static and the dynamic BMS; and determining if the FMP is above a predetermined threshold by a fleet improvement module, and in the event the FMP is above the predetermined threshold, identifying at least one tool of the plurality of tools as poorly performing based on the TMPs; and flagging the identified at least one tool for improvement.

Abstract: A method of preparing recipes for operating a metrology tool, wherein each recipe comprises a set of instructions for measuring at least one dimension in a microelectronic feature. A database includes a plurality of known instructions with best known methods for measuring different dimensions in a microelectronic feature by creating a summary of a recipes used by the metrology tool, and adding to the summary categorization attributes to identify the recipe summary for retrieval from the database. There is provided a desired recipe having instructions for measuring one or more desired dimensions, the desired recipe or portion thereof including a summary of parameters relating to metrology tool function with respect to the microelectronic feature dimension to be measured.

Abstract: Methods, systems and program products are disclosed for determining whether a measurement system under test (MSUT) matches a fleet including at least one other measurement system. The invention implements realistic parameters for analyzing a matching problem including single tool precision, tool-to-tool non-linearities and tool-to-tool offsets. A bottom-line tool matching precision metric that combines these parameters into a single value is then implemented. The invention also includes methods for determining a root cause of a matching problem, and for determining a fleet measurement precision metric.

Abstract: Optimizing a measurement system under test (MSUT) is disclosed. In one embodiment, a method includes selecting a first set of adjustable parameters of the MSUT that affect a quality metric for the MSUT, calculating the quality metric over a range of values of each adjustable parameter in the first set of adjustable parameters, generating a first multidimensional response space based on the calculating step, and determining which value of each adjustable parameter optimizes the quality metric based on the first multidimensional response space. The multidimensional response space may be stored for later recall for other optimization exercises.

Abstract: A method of preparing recipes for operating a metrology tool, each recipe including a set of instructions for measuring dimensions in a microelectronic feature. A database includes a plurality of known instructions with best known methods for measuring different feature dimensions by creating a summary of a recipes used by the tool, and adding categorization attributes to identify the summary for retrieval from the database. There is provided a desired recipe having instructions for measuring desired dimensions, including a summary of parameters relating to tool function for the feature dimension to be measured. The method includes comparing the instructions in the desired recipe with the instructions in the database, identifying differences there between, modifying the desired recipe instructions to conform to the database instructions, verifying the desired recipe prior to using the modified desired recipe by the tool, and using the desired recipe to execute a feature measurement on the tool.

Abstract: A structure, a system and a method are directed towards determination of a dimension of a patterned dimensionally unstable layer when the dimension is measured using an apparatus that induces a variation of the dimension. The structure, system and method use a patterned dimensionally unstable layer pattern design that correlates with an algorithm used to determine the dimension when the dimension is measured using the apparatus that induces the variation of the dimension.

Abstract: A method for reducing edge effect interference with critical dimension (CD) measurement of semiconductor via structures includes forming a test structure in a kerf region of a semiconductor wafer, the test structure including at least a via structure and a trench structure in contact with the via structure. The via structure is formed in accordance with a critical dimension associated with a corresponding via structure in a circuit region of the semiconductor wafer, and the trench structure is formed in accordance with a widened dimension with respect to a minimum ground rule dimension associated with a corresponding trench structure in a circuit region of the semiconductor wafer.

Abstract: A method of identifying failures in a metrology tool system used to measure desired dimensions in microelectronic features. Each metrology tool in the system runs a plurality of recipes for measuring desired dimensions in microelectronic features, with each recipe comprising a set of instructions for measuring at least one dimension in a microelectronic feature. The system includes an error log having stored thereon failures in measurement of microelectronic feature dimensions.

Abstract: A system and method for optimizing and implementing a metrology sampling plan. A system is provided that includes a system for collecting historical metrology data from a metrology tool; and a reduction analysis system that compares an initial capability calculated from the historical metrology data with a recalculated capability for a reduced data set, wherein the reduced data set is obtained by removing a subset of data from the historical metrology data.

Abstract: A process implementing steps for determining encroachment of a spacer structure in a semiconductor device having thick and thin spacer regions, including a transition region formed therebetween. The method steps comprise: obtaining a line width roughness (LWR) measurement at at least one location along each thick, thin and transition spacer regions; determining a threshold LWR measurement value based on the LWR measurements; defining a region of interest (ROI) and obtaining a further LWR measurement in the ROI; comparing the LWR measurement in the ROI against the threshold LWR measurement value; and, notifying a user that either encroachment of the spacer structure is present when the LWR measurement in the ROI is below the threshold LWR measurement value, or that no encroachment of the spacer structure is present when the LWR measurement in the ROI is above the threshold LWR measurement value.

Abstract: Methods, systems and program products are disclosed for determining whether a measurement system under test (MSUT) matches a fleet including at least one other measurement system. The invention implements realistic parameters for analyzing a matching problem including single tool precision, tool-to-tool non-linearities and tool-to-tool offsets. A bottom-line tool matching precision metric that combines these parameters into a single value is then implemented. The invention also includes methods for determining a root cause of a matching problem, and for determining a fleet measurement precision metric.

Abstract: Methods, systems and program products are disclosed for determining whether a measurement system under test (MSUT) matches a fleet including at least one other measurement system. The invention implements realistic parameters for analyzing a matching problem including single tool precision, tool-to-tool non-linearities and tool-to-tool offsets. A bottom-line tool matching precision metric that combines these parameters into a single value is then implemented. The invention also includes methods for determining a root cause issue of a matching problem, and for determining a fleet measurement precision metric. Method, system and program product are also disclosed for attempting to determine a root cause of a subject problem related to at least one of a measurement system under test (MSUT) and a fleet of at least one other measurement system.

Abstract: A process implementing steps for determining encroachment of a spacer structure in a semiconductor device having thick and thin spacer regions, including a transition region formed therebetween. The method steps comprise: obtaining a line width roughness (LWR) measurement at at least one location along each thick, thin and transition spacer regions; determining a threshold LWR measurement value based on the LWR measurements; defining a region of interest (ROI) and obtaining a further LWR measurement in the ROI; comparing the LWR measurement in the ROI against the threshold LWR measurement value; and, notifying a user that either encroachment of the spacer structure is present when the LWR measurement in the ROI is below the threshold LWR measurement value, or that no encroachment of the spacer structure is present when the LWR measurement in the ROI is above the threshold LWR measurement value.