Patents by Inventor Eric Swanger

Eric Swanger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Safety unit for use on vehicles
    Publication number: 20070252538
    Abstract: A safety unit for use on vehicles such as school buses. In one embodiment, a housing is provided for the drive motor and related elements for moving a stop sign on the side of the bus between its retracted and extended positions. The housing has a removable cover to provide access to the drive motor and related elements, and the stop sign is mounted on a driveshaft that extends through a single opening in the bottom wall of the housing. In a second embodiment the safety unit is integrated with an access panel on the school bus.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Applicant: The Ellison Company d/b/a Specialty Manufacturing Company
    Inventor: Eric Swanger
  • Method for filling vias in organic, multi-layer packages
    Patent number: 6098283
    Abstract: A via for an electronic assembly. The assembly includes a substrate which has a via hole. The via hole is filled with a conductive material that extends across a diameter of the hole. The via hole can be filled by reflowing a solder ball that is attached to an outer surface of the substrate. The substrate may be part of a multi-layered integrated circuit package, wherein the vias couples internal routing layers with external contacts of the package. The filled vias can withstand extended thermal life cycles of the package.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: August 8, 2000
    Assignee: Intel Corporation
    Inventors: Mike Goetsch, Jim Siettmann, Leo Craft, Eric Swanger