Patents by Inventor Eric Swee Seng Tan

Eric Swee Seng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic component assemblies with recessed wire bonds and methods of making same
    Patent number: 7696003
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: April 13, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Eric Swee Seng Tan, Edmund Kwok Chung Low