Patents by Inventor Eric Sweetman

Eric Sweetman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10797371
    Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: October 6, 2020
    Assignee: KEYSSA SYSTEMS, INC.
    Inventors: Alan Besel, Eric Sweetman, Bojana Zivanovic
  • Patent number: 10720689
    Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: July 21, 2020
    Assignee: KEYSSA SYSTEMS, INC.
    Inventors: James Gill Shook, Stephan Lang, Alan Besel, Dennis F. Rosenauer, Giriraj Mantrawadi, Eric Sweetman, Bojana Zivanovic, Srikanth Gondi
  • Patent number: 10651892
    Abstract: Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: May 12, 2020
    Assignee: Keyssa Systems, Inc.
    Inventors: Ahmed Khidre, Mohamed Sameh Mahmoud, Eric Sweetman
  • Publication number: 20190356395
    Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.
    Type: Application
    Filed: July 29, 2019
    Publication date: November 21, 2019
    Applicant: Keyssa Systems, Inc.
    Inventors: Giriraj Mantrawadi, Dennis F. Rosenauer, Ian A. Kyles, Eric Sweetman, Roger D. Issac, Stephan Lang
  • Patent number: 10483614
    Abstract: Hinge assemblies that serve as conduits for guiding extremely high frequency (EHF) signals are disclosed herein. The hinge assembly can contain EHF signal energy as data is transmitted from one structure to the other and the hinge assembly can also include a one or more waveguides that define EHF signal pathways through which EHF signal energy is directed. Each hinge assembly may serve as a conduit structure for each coupled pair of contactless communication units (CCUs), and multiple hinge assemblies may be used as separate conduit structures each of several coupled pairs of contactless communication unit.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 19, 2019
    Assignee: KEYSSA SYSTEMS, INC.
    Inventors: Alan Besel, Eric Sweetman
  • Patent number: 10454526
    Abstract: Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: October 22, 2019
    Assignee: Keyssa Systems, Inc.
    Inventors: Ahmed Khidre, Mohamed Sameh Mahmoud, Eric Sweetman
  • Publication number: 20190305398
    Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 3, 2019
    Inventors: Alan Besel, Eric Sweetman, Bojana Zivanovic
  • Patent number: 10403586
    Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: September 3, 2019
    Assignee: Keyssa Systems, Inc.
    Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
  • Patent number: 10389454
    Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: August 20, 2019
    Assignee: Keyssa Systems, Inc.
    Inventors: Giriraj Mantrawadi, Dennis F. Rosenauer, Ian A. Kyles, Eric Sweetman, Roger D. Isaac, Stephan Lang
  • Publication number: 20190157738
    Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.
    Type: Application
    Filed: November 20, 2017
    Publication date: May 23, 2019
    Inventors: James Gill Shook, Stephan Lang, Alan Besel, Dennis F. Rosenauer, Giriraj Mantrawadi, Eric Sweetman, Bojana Zivanovic, Srikanth Gondi
  • Patent number: 10256520
    Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: April 9, 2019
    Assignee: KEYSSA SYSTEMS, INC.
    Inventors: Alan Besel, Eric Sweetman, Bojana Zivanovic
  • Publication number: 20190089037
    Abstract: Hinge assemblies that serve as conduits for guiding extremely high frequency (EHF) signals are disclosed herein. The hinge assembly can contain EHF signal energy as data is transmitted from one structure to the other and the hinge assembly can also include a one or more waveguides that define EHF signal pathways through which EHF signal energy is directed. Each hinge assembly may serve as a conduit structure for each coupled pair of contactless communication units (CCUs), and multiple hinge assemblies may be used as separate conduit structures each of several coupled pairs of contactless communication unit.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 21, 2019
    Inventors: Alan Besel, Eric Sweetman
  • Patent number: 10236552
    Abstract: A waveguide assembly system includes a fixed port, a sliding port, and a transmission path from the fixed port to the sliding port. The transmission path includes a waveguide assembly that includes a first minor face corresponding to the fixed port, a first major face that includes a recess extending from the first minor surface towards the fixed port. The waveguide assembly system also includes a port assembly with a first major surface disposed opposite to the first major surface of the waveguide assembly. The port assembly includes at least one port having a first opening on the first major surface of the port assembly and a second opening on a second major surface of the port assembly. The port assembly includes one or more stubs positioned to impede electromagnetic energy propagation beyond a specified distance within the port tab assembly.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: March 19, 2019
    Assignee: Keyssa, Inc.
    Inventor: Eric Sweetman
  • Publication number: 20180212297
    Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.
    Type: Application
    Filed: January 20, 2017
    Publication date: July 26, 2018
    Inventors: Alan Besel, Eric Sweetman, Bojana Zivanovic
  • Publication number: 20180182723
    Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.
    Type: Application
    Filed: February 5, 2018
    Publication date: June 28, 2018
    Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
  • Patent number: 9954566
    Abstract: Contactless extremely high frequency (EHF) signal directing and blocking structures are disclosed herein. The EHF signal directing structures may focus EHF signal energy along a desired EHF signal pathway. The EHF signal blocking structures may minimize signal propagation through substrates such as circuit boards. Focusing EHF signal energy and selectively blocking the EHF signal energy can minimize or eliminate crosstalk and enhance data transmission speed and integrity.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: April 24, 2018
    Assignee: KEYSSA, INC.
    Inventors: Gary D. McCormack, Emilio Sovero, Eric Sweetman, Bojana Zivanovic
  • Patent number: 9947983
    Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: April 17, 2018
    Assignee: KEYSSA, INC.
    Inventors: Srikanth Gondi, Lex Kosowsky, Gary D. McCormack, Eric Sweetman, Bojana Zivanovic
  • Patent number: 9887169
    Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: February 6, 2018
    Assignee: Keyssa Systems, Inc.
    Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
  • Publication number: 20170309984
    Abstract: A waveguide assembly system includes a fixed port, a sliding port, and a transmission path from the fixed port to the sliding port. The transmission path includes a waveguide assembly that includes a first minor face corresponding to the fixed port, a first major face that includes a recess extending from the first minor surface towards the fixed port. The waveguide assembly system also includes a port assembly with a first major surface disposed opposite to the first major surface of the waveguide assembly. The port assembly includes at least one port having a first opening on the first major surface of the port assembly and a second opening on a second major surface of the port assembly. The port assembly includes one or more stubs positioned to impede electromagnetic energy propagation beyond a specified distance within the port tab assembly.
    Type: Application
    Filed: July 6, 2017
    Publication date: October 26, 2017
    Inventor: Eric Sweetman
  • Publication number: 20170263576
    Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.
    Type: Application
    Filed: March 11, 2016
    Publication date: September 14, 2017
    Applicant: Keyssa Systems, Inc.
    Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi