Abstract: Disclosed herein is a golf club heads having a body portion and a face portion, wherein the face portion comprises a variable thickness profile disposed at an angle on the rear surface of the face plate.

Abstract: The invention provides a method for preparing subassemblies for an electrochemical cell or a stack of electrochemical cells, particularly a stack of fuel cells for the direct generation of electricity. The method includes bonding together two or more electrochemical cell components, such as plates, frames, flow fields, shims, gaskets, membranes and the like, to form subassemblies used to make an electrochemical cell stack. The bonding can be accomplished using either polymeric bonds (i.e., adhesives) where polymer and/or metal components are involved or metallurgical bonds (i.e., solder) where metal components are involved. The bonding provides tightly sealed cells and lower electronic contact resistances between components.

Abstract: The invention provides a method for preparing subassemblies for an electrochemical cell or a stack of electrochemical cells, particularly a stack of fuel cells for the direct generation of electricity. The method includes bonding together two or more electrochemical cell components, such as plates, frames, flow fields, shims, gaskets, membranes and the like, to form subassemblies used to make an electrochemical cell stack. The bonding can be accomplished using either polymeric bonds (i.e., adhesives) where polymer and/or metal components are involved or metallurgical bonds (i.e., solder) where metal components are involved. The bonding provides tightly sealed cells and lower electronic contact resistances between components.

Abstract: The invention provides a method for preparing subassemblies for an electrochemical cell or a stack of electrochemical cells, particularly a stack of fuel cells for the direct generation of electricity. The method includes bonding together two or more electrochemical cell components, such as plates, frames, flow fields, shims, gaskets, membranes and the like, to form subassemblies used to make an electrochemical cell stack. The bonding can be accomplished using either polymeric bonds (i.e., adhesives) where polymer and/or metal components are involved or metallurgical bonds (i.e., solder) where metal components are involved. The bonding provides tightly sealed cells and lower electronic contact resistances between components.

Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Abstract: The present invention provides electronically conducting polymer films formed from formulations of pyrrole and an electron acceptor. The formulations may include photoinitiators, flexibilizers, solvents and the like. These formulations can be used to manufacture multichip modules on typical multichip module substrates, such as alumina, fiberglass epoxy, silicon and polyimide. The formulations and methods of the invention enable the formation of passive electronic circuit elements such as resistors, capacitors and inductors in multichip modules or printed wiring boards.

Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These formulations can be used to manufacture multichip modules on typical multichip module substrates, such as alumina, fiberglass epoxy, silicon and polyimide. The formulations and methods of the invention enable the formation of passive electronic circuit elements such as resistors, capacitors and inductors in multichip modules or printed wiring boards.

Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.