Patents by Inventor Eric T. Wu

Eric T. Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
    Publication number: 20250326084
    Abstract: A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.
    Type: Application
    Filed: July 2, 2025
    Publication date: October 23, 2025
    Inventors: Kun Xu, Patrick A. Higashi, Hassan G. Iravani, Harry Q. Lee, Haosheng Wu, Eric T. Wu, Ningzhuo Cui, Jeonghoon Oh, Christopher Lai, Jun Qian
  • Eddy current monitoring to detect vibration in polishing
    Patent number: 12403561
    Abstract: A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: September 2, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Patrick A. Higashi, Hassan G. Iravani, Harry Q. Lee, Haosheng Wu, Eric T. Wu, Ningzhuo Cui, Jeonghoon Oh, Christopher Lai, Jun Qian
  • EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
    Publication number: 20230286107
    Abstract: A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 14, 2023
    Inventors: Kun Xu, Patrick A. Higashi, Hassan G. Iravani, Harry Q. Lee, Haosheng Wu, Eric T. Wu, Ningzhuo Cui, Jeonghoon Oh, Christopher Lai, Jun Qian