Patents by Inventor Eric Tiongson

Eric Tiongson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9113554
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 18, 2015
    Assignee: Aviat U.S., Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Publication number: 20140198472
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 17, 2014
    Applicant: Aviat U.S., Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Patent number: 8644028
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: February 4, 2014
    Assignee: Aviat U.S., Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Publication number: 20100246147
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Application
    Filed: June 7, 2010
    Publication date: September 30, 2010
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Patent number: 7733667
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: June 8, 2010
    Assignee: Harris Stratex Networks Operating Corporation
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Patent number: 7592887
    Abstract: Waveguide flanges for joining waveguide sections or components are designed to achieve mechanical strength and exhibit desired electrical properties such as relatively low insertion loss and high return loss. The present invention contemplates waveguide interfaces with a new choke flange designed to engage with a shield flange and provide a joint with improved electrical properties. The new choke designs produce a virtual continuity through the waveguide joints and minimize electrical energy leakage. The electrical and mechanical properties of the joint in the waveguide interfaces are robust and able to tolerate lower levels of parts precision, imperfect mating of the flanges without metal-to-metal contact and gaps up to 0.06? or more between the mating flange surfaces.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: September 22, 2009
    Assignee: Harris Stratex Networks Operating Corporation
    Inventors: Yen-Fang Chao, Bruce Corkill, Eric Tiongson, John Ruiz
  • Publication number: 20080117614
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Application
    Filed: November 16, 2006
    Publication date: May 22, 2008
    Applicant: Stratex Networks, Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Publication number: 20080001686
    Abstract: Waveguide flanges for joining waveguide sections or components are designed to achieve mechanical strength and exhibit desired electrical properties such as relatively low insertion loss and high return loss. The present invention contemplates waveguide interfaces with a new choke flange designed to engage with a shield flange and provide a joint with improved electrical properties. The new choke designs produce a virtual continuity through the waveguide joints and minimize electrical energy leakage. The electrical and mechanical properties of the joint in the waveguide interfaces are robust and able to tolerate lower levels of parts precision, imperfect mating of the flanges without metal-to-metal contact and gaps up to 0.06? or more between the mating flange surfaces.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Yen-Fang Chao, Bruce Corkill, Eric Tiongson, John Ruiz