Patents by Inventor Eric Tremble

Eric Tremble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8312404
    Abstract: A method for modeling bond wires in an IC package for predicting noise effects generated by electromagnetic coupling in complex bond wire configurations. A look-up table of equivalent LC circuit models for the bond wires is generated that accurately predicts the effects of the bond wire circuitry of a signal transmission system. Switch and mirror techniques are applied to reduce the bond wire configurations necessary to simulate.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: November 13, 2012
    Assignee: International Business Machines Corporation
    Inventors: Haitian Hu, Timothy W. Budell, Charles S. Chiu, Eric Tremble
  • Publication number: 20100332193
    Abstract: A method for modeling bond wires in an IC package for predicting noise effects generated by electromagnetic coupling in complex bond wire configurations. A look-up table of equivalent LC circuit models for the bond wires is generated that accurately predicts the effects of the bond wire circuitry of a signal transmission system. Switch and mirror techniques are applied to reduce the bond wire configurations necessary to simulate.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Haitian Hu, Timothy W. Budell, Charles S. Chiu, Eric Tremble
  • Publication number: 20050176273
    Abstract: The present invention provides a redistribution package having an upper surface that includes contacts with reduced pitch that correspond, for example, to that of a Controlled Collapse Chip Connection (“C4”) structure formed on a chip, and a lower surface having contacts with increased pitch that correspond, for example, to a printed circuit board employing ball grid array (“BGA”) pads. A series of power, signal and ground conductors extend through the body of the redistribution package and interconnect the circuit board contacts to the chip contacts.
    Type: Application
    Filed: February 10, 2004
    Publication date: August 11, 2005
    Inventors: Timothy Budell, Eric Tremble, Brian Welch