Abstract: Disclosed herein are metal complexes that exhibit multiple radiative decay mechanisms, together with methods for the preparation and use thereof.

Abstract: The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. Such cleaning compositions can include use of a polisher rinse composition, use of a post-CMP composition, or use of a combination of the polisher rinse composition and the post-CMP composition.

Abstract: Disclosed is a method including receiving a depth map estimated using data based on image and data received from a movement sensor as input, generating an alignment parameter based on the depth map, adding the alignment parameter to a pre-calibration state to define a user operational calibration state, generating scale parameters and shift parameters based on features associated with the data received from the image and movement sensor, and calibrating the image and movement sensor based on the user operational calibration state, the scale parameters and the shift parameters.

Abstract: A method including receiving (S605) a request for a depth map, generating (S625) a hybrid depth map based on a device depth map (110) and downloaded depth information (105), and responding (S630) to the request for the depth map with the hybrid depth map (415). The device depth map (110) can be depth data captured on a user device (515) using sensors and/or software. The downloaded depth information (105) can be associated with depth data, map data, image data, and/or the like stored on a remote (to the user device) server (505).

Abstract: The present document relates to a polishing composition that includes at least one abrasive, at least one pH adjuster, at least one guanamine compound, and water. The polishing composition can be used in a method of polishing a substrate including applying the polishing composition to a surface of a substrate and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate. The surface of the substrate can include tungsten and/or molybdenum.

Abstract: This disclosure relates to polishing compositions containing at least one abrasive, at least one polymer removal enhancer, and at least one solvent. The polishing compositions of this disclosure may optionally include at least one of a cationic surfactant, an azole-containing corrosion inhibitor, or a nonionic surfactant. The polishing compositions of this disclosure may polish a polymeric substrate at a rate of at least about 200 ?/min.

Abstract: Disclosed herein are metal complexes that exhibit multiple radiative decay mechanisms, together with methods for the preparation and use thereof.

Abstract: This disclosure relates to a polishing composition that includes an abrasive; at least one Si-containing compound including an acidic group, an ester thereof, or a salt thereof; and water. This disclosure also features a method of using the polishing composition to polish a substrate.

Abstract: Disclosed herein are metal complexes that exhibit multiple radiative decay mechanisms, together with methods for the preparation and use thereof.

Abstract: The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.

Abstract: The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.

Abstract: Disclosed herein are various embodiments for estimating shipping costs of items purchased on an online market. An embodiment operates by detecting a sales transaction between a seller and a buyer for an item via an online marketplace. An item vector representing the item as created by a deep learning model based on a plurality of characteristics associated with the item is received. A set of proximate vectors to the item vector, each of the proximate vectors corresponding to a past listings where a past shipping cost from shipping a product in the past listing is known are identified. A weighted average is calculated from the past shipping cost of each of the past listings. A dimensional weight of the item is estimated based on the weight average, and a shipping cost for the item is estimated based on the estimated dimensional weight prior to providing the item to a carrier.

Abstract: A system and method of detecting scale from image data obtained by a computing device together with position and orientation of the computing device is provided. The scale may be used for the virtual selection and/or fitting of a wearable device such as a head mounted wearable device and other such wearable devices. The system and method may include capturing a series of frames of image data, and detecting one or more fixed features in the series of frames of image data. Position and orientation data associated with the capture of the image data is combined with the position data related to the one or more fixed features to set a scale that is applicable to the image data. Scale may be determined without the use of a reference object having known scale, specialized equipment, and the like.

Abstract: A method including receiving (S605) a request for a depth map, generating (S625) a hybrid depth map based on a device depth map (110) and downloaded depth information (105), and responding (S630) to the request for the depth map with the hybrid depth map (415). The device depth map (110) can be depth data captured on a user device (515) using sensors and/or software. The downloaded depth information (105) can be associated with depth data, map data, image data, and/or the like stored on a remote (to the user device) server (505).

Abstract: This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C4 to C40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of from about 2 to about 6.5.

Abstract: Disclosed is a method including receiving a depth map estimated using data based on image and data received from a movement sensor as input, generating an alignment parameter based on the depth map, adding the alignment parameter to a pre-calibration state to define a user operational calibration state, generating scale parameters and shift parameters based on features associated with the data received from the image and movement sensor, and calibrating the image and movement sensor based on the user operational calibration state, the scale parameters and the shift parameters.

Abstract: This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C4 to C40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of from about 2 to about 6.5.

Abstract: A method including receiving a first depth image associated with a first frame at a first time of an augmented reality (AR) application, the first depth image representing at least a first portion of a real-world space storing the first depth image receiving a second depth image associated with a second frame at a second time, after the first time, of the AR application, the second depth image representing at least a second portion of the real-world space generating a real-world image by blending, at least, the stored first depth image with the second depth image receiving a rendered AR object combining the AR object in the real-world image and displaying the real-world image combined with the AR object.