Abstract: A panel nut including an upper arm, a lower arm, and at least one transition arm extending between the upper arm and the lower arm to allow the upper arm to elastically deflect with respect to the lower arm is disclosed. The upper arm includes a forward flange, an inner member having a first end and an opposite second end, an outer member having a first end and an opposite second end, and a thread housing formed on the inner member. The lower arm includes a forward edge, an opposite rear end, a retainer hinge, and a retainer extending from the retainer hinge toward the rear end and toward the upper arm. The retainer is configured to elastically deflect between an unstressed position and a stressed position to be received within the thread housing when in the unstressed position.

Abstract: Disclosed herein is a system for providing a user with remote real time access to pharmaceuticals, the system comprising a plurality of carts which accept cassettes that contain pharmaceuticals. The carts preferably contain a CPU which can communicate with a database. A remote CPU is also in electrical communication with the database and may be placed at a pharmacy. When a specific pharmaceutical is required for a specific patient, a user can electronically request a one time access code (OTAC) from the remote CPU. If the request is valid, an OTAC can be sent both electronically to the database in addition to being sent to the user. If the user inputs an OTAC that matches the one stored on the database, the cart is unlocked to provide access to the requested pharmaceutical. Pharmaceuticals that are currently found in the cart can be checked remotely by communicating with the database.

Abstract: An intelligent endoscopic light source system for controlling the intensity of a light source, including a light source emitting light at a first intensity, an attenuator positioned to receive light from the light source at a first intensity and movable to pass light from the light source at a second intensity, a sensor mounted to the attenuator for measuring the first intensity, and a controller for receiving the intensity measurement from the sensor and moving the attenuator to pass light at a desired second intensity.

Abstract: Systems and methods in accordance with embodiments of the invention implement three-dimensional (3D) gesture based graphical user interfaces (GUI) using gesture reactive interface objects. One embodiment includes using a computing device to render an initial user interface comprising a set of interface objects, detect a targeting 3D gesture in captured image data that identifies a targeted interface object within the user interface, change the rendering of at least the targeted interface object within the user interface in response to the targeting 3D gesture that targets the interface object, detect an interaction 3D gesture in additional captured image data that identifies a specific interaction with a targeted interface object, modify the user interface in response to the interaction with the targeted interface object identified by the interaction 3D gesture, and render the modified user interface.

Abstract: An intelligent endoscopic light source system for controlling the intensity of a light source, including a light source emitting light at a first intensity, an attenuator positioned to receive light from the light source at a first intensity and movable to pass light from the light source at a second intensity, a sensor mounted to the attenuator for measuring the first intensity, and a controller for receiving the intensity measurement from the sensor and moving the attenuator to pass light at a desired second intensity.

Abstract: Exposed copper regions on a semiconductor substrate can be etched by a wet etching solution comprising (i) one or more complexing agents selected from the group consisting of bidentate, tridentate, and quadridentate complexing agents; and (ii) an oxidizer, at a pH of between about 5 and 12. In many embodiments, the etching is substantially isotropic and occurs without visible formation of insoluble species on the surface of copper. The etching is useful in a number of processes in semiconductor fabrication, including for partial or complete removal of copper overburden, for planarization of copper surfaces, and for forming recesses in copper-filled damascene features. Examples of suitable etching solutions include solutions comprising a diamine (e.g., ethylenediamine) and/or a triamine (e.g., diethylenetriamine) as bidentate and tridentate complexing agents respectively and hydrogen peroxide as an oxidizer.

Abstract: Systems and methods in accordance with embodiments of the invention implement three-dimensional (3D) gesture based graphical user interfaces (GUI) using gesture reactive interface objects. One embodiment includes using a computing device to render an initial user interface comprising a set of interface objects, detect a targeting 3D gesture in captured image data that identifies a targeted interface object within the user interface, change the rendering of at least the targeted interface object within the user interface in response to the targeting 3D gesture that targets the interface object, detect an interaction 3D gesture in additional captured image data that identifies a specific interaction with a targeted interface object, modify the user interface in response to the interaction with the targeted interface object identified by the interaction 3D gesture, and render the modified user interface.

Abstract: Disclosed herein is a system for providing a user with remote real time access to pharmaceuticals, the system comprising a plurality of carts which accept cassettes that contain pharmaceuticals. The carts preferably contain a CPU which can communicate with a database. A remote CPU is also in electrical communication with the database and may be placed at a pharmacy. When a specific pharmaceutical is required for a specific patient, a user can electronically request a one time access code (OTAC) from the remote CPU. If the request is valid, an OTAC can be sent both electronically to the database in addition to being sent to the user. If the user inputs an OTAC that matches the one stored on the database, the cart is unlocked to provide access to the requested pharmaceutical. Pharmaceuticals that are currently found in the cart can be checked remotely by communicating with the database.

Abstract: Exposed copper regions on a semiconductor substrate can be etched by a wet etching solution comprising (i) one or more complexing agents selected from the group consisting of bidentate, tridentate, and quadridentate complexing agents; and (ii) an oxidizer, at a pH of between about 5 and 12. In many embodiments, the etching is substantially isotropic and occurs without visible formation of insoluble species on the surface of copper. The etching is useful in a number of processes in semiconductor fabrication, including for partial or complete removal of copper overburden, for planarization of copper surfaces, and for forming recesses in copper-filled damascene features. Examples of suitable etching solutions include solutions comprising a diamine (e.g., ethylenediamine) and/or a triamine (e.g., diethylenetriamine) as bidentate and tridentate complexing agents respectively and hydrogen peroxide as an oxidizer.

Abstract: An etching process for selectively etching exposed metal surfaces of a substrate and forming a conductive capping layer over the metal surfaces is described. In some embodiments, the etching process involves oxidation of the exposed metal to form a metal oxide that is subsequently removed from the surface of the substrate. The exposed metal may be oxidized by using solutions containing oxidizing agents such as peroxides or by using oxidizing gases such as those containing oxygen or ozone. The metal oxide produced is then removed using suitable metal oxide etching agents such as glycine. The oxidation and etching may occur in the same solution. In other embodiments, the exposed metal is directly etched without forming a metal oxide. Suitable direct metal etching agents include any number of acidic solutions. The process allows for controlled oxidation and/or etching with reduced pitting.

Abstract: Exposed copper regions on a semiconductor substrate can be etched by a wet etching solution comprising (i) one or more complexing agents selected from the group consisting of bidentate, tridentate, and quadridentate complexing agents; and (ii) an oxidizer, at a pH of between about 5 and 12. In many embodiments, the etching is substantially isotropic and occurs without visible formation of insoluble species on the surface of copper. The etching is useful in a number of processes in semiconductor fabrication, including for partial or complete removal of copper overburden, for planarization of copper surfaces, and for forming recesses in copper-filled damascene features. Examples of suitable etching solutions include solutions comprising a diamine (e.g., ethylenediamine) and/or a triamine (e.g., diethylenetriamine) as bidentate and tridentate complexing agents respectively and hydrogen peroxide as an oxidizer.

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract: A system and method for managing access to a plurality of carts. A plurality of users may be created in a database, each user having unique identifying information. Users may be grouped into user groups when having similar attributes. Each cart may have an entry in the database with associated attributes. Carts may be grouped into cart groups for carts having similar attributes. Users may be given access to cart either individually, through a user group that has access to the cart, by given access to an entire group of carts, or through a user group that has access to an entire group of carts. The various associations can be interwoven to provide groups and sub-groups for managing applications where multiple users must interact with multiple carts. The carts can store access logs which may be communicated in real time to a computing device or may be stored locally at the cart for later access by an administrator.

Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

Abstract: An etching process for selectively etching exposed metal surfaces of a substrate and forming a conductive capping layer over the metal surfaces is described. In some embodiments, the etching process involves oxidation of the exposed metal to form a metal oxide that is subsequently removed from the surface of the substrate. The exposed metal may be oxidized by using solutions containing oxidizing agents such as peroxides or by using oxidizing gases such as those containing oxygen or ozone. The metal oxide produced is then removed using suitable metal oxide etching agents such as glycine. The oxidation and etching may occur in the same solution. In other embodiments, the exposed metal is directly etched without forming a metal oxide. Suitable direct metal etching agents include any number of acidic solutions. The process allows for controlled oxidation and/or etching with reduced pitting.

Abstract: An etching process for selectively etching exposed metal surfaces of a substrate and forming a conductive capping layer over the metal surfaces is described. In some embodiments, the etching process involves oxidation of the exposed metal to form a metal oxide that is subsequently removed from the surface of the substrate. The exposed metal may be oxidized by using solutions containing oxidizing agents such as peroxides or by using oxidizing gases such as those containing oxygen or ozone. The metal oxide produced is then removed using suitable metal oxide etching agents such as glycine. The oxidation and etching may occur in the same solution. In other embodiments, the exposed metal is directly etched without forming a metal oxide. Suitable direct metal etching agents include any number of acidic solutions. The process allows for controlled oxidation and/or etching with reduced pitting.

Abstract: An anti-tip assembly for use with a shelving system movable along a track. The track includes a first flange overhanging a first longitudinally extending channel and a second flange overhanging a second longitudinally extending channel. The anti-tip assembly includes an open ended channel, and a first bracket having a first flange extending into a first open end of the open ended channel, and a second flange extending into the first channel of the track. The anti-tip assembly further includes a second bracket having a first flange extending into a second open end of the open ended channel, and a second flange extending into the second channel of the track. The first and second brackets are slidable inside the open ended channel and coupled together with a maximum spacing therebetween. A biasing member biases the first and second brackets outwardly away from one another within the maximum spacing.

Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract: Exposed copper regions on a semiconductor substrate can be etched by a wet etching solution comprising (i) one or more complexing agents selected from the group consisting of bidentate, tridentate, and quadridentate complexing agents; and (ii) an oxidizer, at a pH of between about 5 and 12. In many embodiments, the etching is substantially isotropic and occurs without visible formation of insoluble species on the surface of copper. The etching is useful in a number of processes in semiconductor fabrication, including for partial or complete removal of copper overburden, for planarization of copper surfaces, and for forming recesses in copper-filled damascene features. Examples of suitable etching solutions include solutions comprising a diamine (e.g., ethylenediamine) and/or a triamine (e.g., diethylenetriamine) as bidentate and tridentate complexing agents respectively and hydrogen peroxide as an oxidizer.