Patents by Inventor Eric Williams Beach

Eric Williams Beach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to manufacture a thin film resistor
    Patent number: 7838429
    Abstract: A method for manufacturing a semiconductor device that method comprises forming a thin film resistor by a process that includes depositing a resistive material layer on a semiconductor substrate. The process also includes depositing an insulating layer on the resistive material layer, and performing a first dry etch process on the insulating layer to form an insulative body. The process further includes performing a second dry etch process on the resistive material layer to form a resistive body. The resistive body and the insulative body have substantially identical perimeters.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: November 23, 2010
    Assignee: Texas Instruments Incorporated
    Inventors: Tony Phan, Kyle M. Flessner, Martin B. Mollat, Connie Wang, Arthur Pan, Eric William Beach, Michelle R. Keramidas, Karen Elizabeth Burks
  • METHOD TO MANUFACTURE A THIN FILM RESISTOR
    Publication number: 20090023263
    Abstract: A method for manufacturing a semiconductor device that method comprises forming a thin film resistor by a process that includes depositing a resistive material layer on a semiconductor substrate. The process also includes depositing an insulating layer on the resistive material layer, and performing a first dry etch process on the insulating layer to form an insulative body. The process further includes performing a second dry etch process on the resistive material layer to form a resistive body. The resistive body and the insulative body have substantially identical perimeters.
    Type: Application
    Filed: July 18, 2007
    Publication date: January 22, 2009
    Applicant: Texas Instruments Incorporated
    Inventors: Tony Phan, Kyle M. Flessner, Martin B. Mollat, Connie Wang, Arthur Pan, Eric William Beach, Michelle R. Keramidas, Karen Elizabeth Burks
  • Thin film resistor structure and method of fabricating a thin film resistor structure
    Patent number: 7403095
    Abstract: A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) layer. The combination of the Ti layer and the TiN layer mitigates resistance associated with the electrical interface layers.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: July 22, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Brian Vialpando, Eric William Beach, Philipp Steinmann
  • Thin film resistor integration in a dual damascene structure
    Patent number: 7323751
    Abstract: A thin film resistor and at least one metal interconnect are formed in an integrated circuit. A first dielectric layer is formed over a metal interconnect layer. A thin film resistor is formed on the first dielectric layer and a second dielectric layer formed over the thin film resistor. Thin film resistor vias and the at least one trench are formed concurrently in the second dielectric layer. A trench via is then formed in the at least one trench. The trench via, the at least one trench and the thin film resistor vias are filled with a contact material layer to form thin film resistor contacts and at least one conductive line coupled to the metal interconnect layer.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: January 29, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Eric Williams Beach, Rajneesh Jaiswal
  • Thin film resistor structure and method of fabricating a thin film resistor structure
    Patent number: 7112286
    Abstract: A thin film resistor structure and a method of fabricating a thin film resistor structure is provided. The thin film resistor structure includes an electrical interface layer or head layer that is a combination of a Titanium (Ti) layer and a Titanium Nitride (TiN) layer. The combination of the Ti layer and the TiN layer mitigates resistance associated with the electrical interface layers.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: September 26, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Brian Vialpando, Eric William Beach, Philipp Steinmann
  • Thin film resistor integration in a dual damascene structure
    Publication number: 20040245575
    Abstract: A thin film resistor and at least one metal interconnect are formed in an integrated circuit. A first dielectric layer is formed over a metal interconnect layer. A thin film resistor is formed on the first dielectric layer and a second dielectric layer formed over the thin film resistor. Thin film resistor vias and the at least one trench are formed concurrently in the second dielectric layer. A trench via is then formed in the at least one trench. The trench via, the at least one trench and the thin film resistor vias are filled with a contact material layer to form thin film resistor contacts and at least one conductive line coupled to the metal interconnect layer.
    Type: Application
    Filed: June 3, 2003
    Publication date: December 9, 2004
    Inventors: Eric Williams Beach, Rajneesh Jaiswal