Patents by Inventor Eric Wintenberger

Eric Wintenberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor batch heating assembly
    Patent number: 7312422
    Abstract: A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1° C. per second for heating the wafers in the wafer boat.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: December 25, 2007
    Assignee: Momentive Performance Materials Inc.
    Inventors: Eric Wintenberger, Douglas Alan Longworth, Wei Fan, John Thomas Mariner
  • Semiconductor Batch Heating Assembly
    Publication number: 20070215596
    Abstract: A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one heating zone and encapsulated in a continuous overcoat layer, a heat reflector comprising a heat reflective surface disposed on the heating element, and the heating element has a ramp rate of at least 1° C. per second for heating the wafers in the wafer boat.
    Type: Application
    Filed: October 11, 2006
    Publication date: September 20, 2007
    Applicant: General Electric Company
    Inventors: Eric Wintenberger, Douglas Alan Longworth, Wei Fan, John Thomas Mariner
  • Fast heating and cooling wafer handling assembly and method of manufacturing thereof
    Publication number: 20060127067
    Abstract: A thermal control device for wafer processing which comprises a) a platform for placement of an object of various sizes to be heated, b) at least a shaft extending substantially transverse to the platform; and c) a plurality of resistance heating elements patterned in a plurality of circuits defining at least one zone for independent controlled heating of objects of varying sizes on the platform.
    Type: Application
    Filed: November 8, 2005
    Publication date: June 15, 2006
    Inventors: Eric Wintenberger, Sridhar Prasad, John Mariner, Zhong-Hao Lu