Patents by Inventor Eric Y. Chan

Eric Y. Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7341384
    Abstract: A fiber optic transceiver module, having built-in test capability and a low physical profile that meets mil spec requirements, comprises a housing. The housing comprises an optical fiber having an angled end that defines an acute angle relative to the longitudinal axis of the optical fiber, an optical source for emitting an optical signal which is reflected by the angled end of the optical fiber and propagated along the optical fiber, and an optical detector for receiving a return optical signal transmitted through the angled end of the optical fiber in response to reflection from a discontinuity in the optical fiber. The acute angle may be 48 degrees, causing a desired portion of the signal emitted from the optical source to be propagated along the optical fiber and to cause a desired portion of the return optical signal to be transmitted through the angled end to a photodetector.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: March 11, 2008
    Assignee: The Boeing Company
    Inventors: Eric Y. Chan, Dennis G. Koshinz
  • Patent number: 6873780
    Abstract: A method for fabricating an array of optical fibers having respective angled end faces is provided which permits the entire array of optical fibers to be polished at the same time without requiring that the entire array be scrapped if one or more of the optical fibers has a defect. A plurality of optical fibers are temporarily secured, such as by means of wax, to a holding fixture such that the end faces of the optical fibers are exposed. The end faces of the optical fibers are then polished such that the resulting polished end faces are disposed at an angle. The optical fibers may then be removed from the holding fixture. If the optical fibers are temporarily secured to the holding fixture with wax, the wax is at least partially melted prior to removing the optical fibers therefrom. The optical fibers may then be assembled in an array.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: March 29, 2005
    Assignee: The Boeing Company
    Inventors: Eric Y. Chan, Dennis G. Koshinz
  • Publication number: 20040204712
    Abstract: A spinal fixation plate may include a first section having at least one bore formed therein for receiving a bone anchor effective to mate the first section to a first vertebra and a second section having at least one bore formed therein for receiving a bone anchor effective to mate the second section to a second vertebra. At least one of the first section and the second section may have a canted section oriented at a cant angle to at least one other portion of the at least one of the first section and the second section. The cant angle may be selected to correspond to the geometry of at least one of the first vertebra and the second vertebra.
    Type: Application
    Filed: September 17, 2003
    Publication date: October 14, 2004
    Inventors: Eric Kolb, Eric Y. Chan
  • Publication number: 20030235366
    Abstract: A method for fabricating an array of optical fibers having respective angled end faces is provided which permits the entire array of optical fibers to be polished at the same time without requiring that the entire array be scrapped if one or more of the optical fibers has a defect. A plurality of optical fibers are temporarily secured, such as by means of wax, to a holding fixture such that the end faces of the optical fibers are exposed. The end faces of the optical fibers are then polished such that the resulting polished end faces are disposed at an angle. The optical fibers may then be removed from the holding fixture. If the optical fibers are temporarily secured to the holding fixture with wax, the wax is at least partially melted prior to removing the optical fibers therefrom. The optical fibers may then be assembled in an array.
    Type: Application
    Filed: June 21, 2002
    Publication date: December 25, 2003
    Applicant: The Boeing Company
    Inventors: Eric Y. Chan, Dennis G. Koshinz
  • Patent number: 5692086
    Abstract: An optoelectronic package includes an optical fiber cable assembly and feedthrough assembly which provide high performance and high reliability optical fiber alignment, locking and sealing. An optical fiber is fed through a nose tube into the package. The fiber is selectively metallized at its end. A solder lock joint on a substrate on the package floor preferably of an SnAg- based or SnSb- based solder. It surrounds at least part of the metallized portion of the fiber so as to hold the fiber in its desired position, in alignment with an optoelectronic device in the package. With Sn metallization on the fiber, this results in a highly reliable solder lock joint. A solder seal joint forms a hermetic seal between the nose tube and the Au metallized fiber. This solder is preferably 80Au20Sn. A rigid cylindrical seal tube sleeve insert on the fiber is designed to guide the fiber into the nose tube without bending or damaging the fiber.
    Type: Grant
    Filed: October 25, 1995
    Date of Patent: November 25, 1997
    Assignee: The Boeing Company
    Inventors: Mark W. Beranek, Eric Y. Chan, David Gastellum, Mostafa Rassaian, Mark Voitek
  • Patent number: 5189679
    Abstract: A semiconductor laser having increased reliability and enhanced high temperature operation. The device is based upon GaAs/AlGaAs, and comprises a quantum well active layer that is strained by the inclusion of the indium. The rear facet of the device has a high reflectivity coating, and the front facet reflectivity and cavity length are adjusted based upon the required output power. For high output power at high temperature, long cavity lengths and low front facet reflectivities are used. For low current operation and low output power at high temperature, shorter cavities and higher front facet reflectivities are used. The lasers are capable of reliably operating at temperatures up to and in excess of 100.degree. C.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: February 23, 1993
    Assignee: The Boeing Company
    Inventors: Pamela L. Derry, Chi-Shain Hong, Eric Y. Chan, Luis Figueroa, R. Jennhwa Fu
  • Patent number: 5109447
    Abstract: A broadband optical source with a flat spectral output and high output power for use in a fiber optic sensor interface system. The broadband optical source comprises N optical sources such as LEDs, where N is a positive integer greater than 1. The N optical sources output a plurality of optical signals having center wavelengths .lambda.i, spectral widths .DELTA..lambda.i and powers Pi, where i is a positive integer corresponding to each of the N optical sources. The broadband LED source also comprises a waveguide coupler for receiving and combining said plurality of optical signals and for outputting a broadband optical signal. The broadband LED source outputs extremely spectrally flat, broadband signals when the center wavelengths .lambda.i are separated by approximately 2/3 of the spectral widths .DELTA..lambda.i.
    Type: Grant
    Filed: March 4, 1991
    Date of Patent: April 28, 1992
    Assignee: The Boeing Company
    Inventor: Eric Y. Chan
  • Patent number: 5071213
    Abstract: An optical coupler for coupling light between an end of a fiber-optic cable and the optical port of an electro-optic device, and an improved method for making the coupler. A silicon substrate is etched to form a groove dimensioned to hold the fiber-optic cable, with the end of the fiber-optic cable adjacent to the terminating surface of the groove. Alignment means are then formed on the working surface, and used to secure positioning means to the substrate at a predetermined position. The positioning means includes a positioning surface oriented to abut a reference surface of the electro-optic device. The electro-optic device is then mounted on the working surface, with its reference surface abutting the positioning surface. The alignment means is formed so that the optical port is positioned to efficiently couple light between the end of the fiber-optic cable and the optical port, via reflection off the terminating surface.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: December 10, 1991
    Assignee: The Boeing Company
    Inventor: Eric Y. Chan
  • Patent number: 5055894
    Abstract: Interleaved arrays of photoelectronic devices are fabricated utilizing one-step epitaxial growth of all active layers and simple planar processing. Exemplary arrays include interleaved LED transmitters and PIN photodiode receivers that operate at the same wavelength on light that enters the PINs and exits the LEDs along opposite but parallel paths and interleaved arrays of LED transmitters that emit light at two different wavelengths.
    Type: Grant
    Filed: June 12, 1990
    Date of Patent: October 8, 1991
    Assignee: The Boeing Company
    Inventor: Eric Y. Chan
  • Patent number: 4879250
    Abstract: Interleaved arrays of photoelectronic devices are fabricated utilizing one-step epitaxial growth of all active layers and simple planar processing. Exemplary arrays include interleaved LED transmitters and PIN photodiode receivers that operate at the same wavelength on light that enters the PINs and exits the LEDs along opposite but parallel paths and interleaved arrays of LED transmitters that emit light at two different wavelengths.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: November 7, 1989
    Assignee: The Boeing Company
    Inventor: Eric Y. Chan
  • Patent number: 4775640
    Abstract: Apparatus for automatically testing LEDs formed in a wafer (11) includes a computer (15), a test probe (21) for applying a bias to an individual LED and a sensor probe (32) for positioning the test probe with respect to a contact (57) on the LED. Light from the LED is transmitted by an optical fiber (22) to opto-electronic equipment (18) for analysis and characterization by the computer (15). LED bias is provided by a pulse generator (35) and faulty diodes are marked by a marker probe (31). Each LED contains a lens portion (60) for directing LED light to the optical fiber (22).
    Type: Grant
    Filed: May 1, 1987
    Date of Patent: October 4, 1988
    Assignee: American Telephone and Telegraph Company
    Inventor: Eric Y. Chan