Patents by Inventor Eric Y Chu

Eric Y Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8339219
    Abstract: The integration of surface acoustic wave (SAW) filters, microfabricated transmission lines, and sensors onto polymer substrates in order to enable a passive wireless sensor platform is described herein. Incident microwave pulses on an integrated antenna are converted to an acoustic wave via a SAW filter and transmitted to an impedance based sensor, which for this work is a photodiode. Changes in the sensor state induce a corresponding change in the impedance of the sensor resulting in a reflectance profile. Data collected at a calibrated receiver is used to infer the state of the sensor. Based on this principal, light levels were passively and wirelessly demonstrated to be sensed at distances of up to about 12 feet.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: December 25, 2012
    Assignee: Sandia Corporation
    Inventors: Jack L. Skinner, Eric Y Chu, Harvey Ho