Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint The interconnection system is capable of transferring information at high data rates.

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

Abstract: A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.