Patents by Inventor Erica Anne Sanker

Erica Anne Sanker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT INTERFACE AND METHOD OF MAKING THE SAME
    Publication number: 20180331443
    Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 15, 2018
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: AARON ASHLEY HATHAWAY, ROBERT MILLER, ERICA ANNE SANKER
  • Integrated circuit interface and method of making the same
    Patent number: 10128592
    Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: November 13, 2018
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Aaron Ashley Hathaway, Robert Miller, Erica Anne Sanker