Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from conductive housing structures running along the edges of a device. The antenna may have a pair of switchable return paths that bridge a slot between the antenna resonating element and an antenna ground. An adjustable component and a feed may be coupled in parallel across the slot. The adjustable component may switch a capacitor into use or out of use and the return paths may be selectively opened and closed to compensate for antenna loading due to the presence of external objects near the electronic device.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include cellular telephone antennas, wireless local area network antennas, antenna structures for receiving satellite navigation system signals, and other antennas. An antenna may have an antenna resonating element such as an inverted-F antenna resonating element. The inverted-F antenna resonating element may have an inverted-F antenna resonating element arm formed from metal traces on a flexible printed circuit. The flexible printed circuit may be soldered to an antenna grounding clip. A screw may attach the clip, a speaker tab, a connector bracket, and other metal structures to a metal device housing that serves as ground for the antenna. The screw may be isolated from the antenna grounding clip and the other metal structures by an insulating structure such as an insulating gasket.

Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from conductive housing structures running along the edges of a device. The antenna may have a pair of switchable return paths that bridge a slot between the antenna resonating element and an antenna ground. An adjustable component and a feed may be coupled in parallel across the slot. The adjustable component may switch a capacitor into use or out of use and the return paths may be selectively opened and closed to compensate for antenna loading due to the presence of external objects near the electronic device.

Abstract: A consumer electronic product includes a switchable inductor array coupled to the RF antenna, the switchable inductor array comprising inductive elements and a switch circuit coupled to the inductor array to select at least one of the inductive elements and couple the selected inductive element with the RF antenna. The product can further include an assembly having a mesh that is strengthened by a stiffener. A multi-layer adhesive have a conductive layer that can be used to shield the RF antenna and adhesive layers that can provide adhesion between the stiffener and the housing of the product. The assembly can be covered by a cowling that is made of metal to provide further shielding. To reduce potential coupling between the RF antenna and the cowling, the cowling can have a portion that is formed of plastic to distance its metal portion from the antenna.

Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from peripheral conductive structures running along the edges of a device housing. Elongated conductive members may longitudinally divide openings between the peripheral conductive housing structures and the ground. The elongated conductive members may extend from an internal ground to outer ends of the elongated conductive members that are located adjacent to the gaps. Transmission lines may extend along the elongated conductive members to antenna feeds at the outer ends. The elongated conductive members may form open slots that serve as slot antenna resonating elements for the antenna.

Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from peripheral conductive structures running along the edges of a device housing. Elongated conductive members may longitudinally divide openings between the peripheral conductive housing structures and the ground. The elongated conductive members may extend from an internal ground to outer ends of the elongated conductive members that are located adjacent to the gaps. Transmission lines may extend along the elongated conductive members to antenna feeds at the outer ends. The elongated conductive members may form open slots that serve as slot antenna resonating elements for the antenna.

Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from conductive housing structures running along the edges of a device. The antenna may have a pair of switchable return paths that bridge a slot between the antenna resonating element and an antenna ground. An adjustable component and a feed may be coupled in parallel across the slot. The adjustable component may switch a capacitor into use or out of use and the return paths may be selectively opened and closed to compensate for antenna loading due to the presence of external objects near the electronic device.

Abstract: An electronic device may have wireless circuitry with antennas. An antenna resonating element arm for an antenna may be formed from peripheral conductive structures running along the edges of a device housing. Elongated conductive members may longitudinally divide openings between the peripheral conductive housing structures and the ground. The elongated conductive members may extend from an internal ground to outer ends of the elongated conductive members that are located adjacent to the gaps. Transmission lines may extend along the elongated conductive members to antenna feeds at the outer ends. The elongated conductive members may form open slots that serve as slot antenna resonating elements for the antenna.

Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

Abstract: A test system is provided for performing radio-frequency tests on an electronic device under test (DUT) having multiple antennas. The test system may include a test unit for generating radio-frequency test signals, a test enclosure, and a test antenna fixture. The test fixture may include tunable antenna circuitry, antenna tuning elements, a test sensor, a microcontroller, a battery, and a solar cell that charges the battery, each of which is mounted on a test fixture within the test enclosure. The test sensor may be used to detect stimuli issued by the DUT. In response to detecting the stimuli, the microcontroller may send control signals to the antenna tuning elements to configure the antenna circuitry in different modes. Each of the different modes may be optimized to test a selected one of the multiple antennas in the DUT when operating using different radio access technologies and at different frequencies.

Abstract: An electronic device may be provided with shared antenna structures that can be used to form both a near-field-communications antenna such as a loop antenna and a non-near-field communications antenna such as an inverted-F antenna. The antenna structures may include conductive structures such as metal traces on printed circuits or other dielectric substrates, internal metal housing structures, or other conductive electronic device housing structures. A main resonating element arm may be separated from an antenna ground by an opening. A non-near-field communications antenna return path and antenna feed path may span the opening. A balun may have first and second electromagnetically coupled inductors. The second inductor may have terminals coupled across differential signal terminals in a near-field communications transceiver. The first inductor may form part of the near-field communications loop antenna.

Abstract: An electronic device may be provided with shared antenna structures that can be used to form both a near-field-communications antenna such as a loop antenna and a non-near-field communications antenna such as an inverted-F antenna. The antenna structures may include conductive structures such as metal traces on printed circuits or other dielectric substrates, internal metal housing structures, or other conductive electronic device housing structures. A main resonating element arm may be separated from an antenna ground by an opening. A non-near-field communications antenna return path and antenna feed path may span the opening. A balun may have first and second electromagnetically coupled inductors. The second inductor may have terminals coupled across differential signal terminals in a near-field communications transceiver. The first inductor may form part of the near-field communications loop antenna.

Abstract: An electronic device may be provided with shared antenna structures that can be used to form both a near-field-communications antenna such as a loop antenna and a non-near-field communications antenna such as an inverted-F antenna. The antenna structures may include conductive structures such as metal traces on printed circuits or other dielectric substrates, internal metal housing structures, or other conductive electronic device housing structures. A main resonating element arm may be separated from an antenna ground by an opening. A non-near-field communications antenna return path and antenna feed path may span the opening. A balun may have first and second electromagnetically coupled inductors. The second inductor may have terminals coupled across differential signal terminals in a near-field communications transceiver. The first inductor may form part of the near-field communications loop antenna.

Abstract: A test system is provided for performing radio-frequency tests on an electronic device under test (DUT) having multiple antennas. The test system may include a test unit for generating radio-frequency test signals, a test enclosure, and a test antenna fixture. The test fixture may include tunable antenna circuitry, antenna tuning elements, a test sensor, a microcontroller, a battery, and a solar cell that charges the battery, each of which is mounted on a test fixture within the test enclosure. The test sensor may be used to detect stimuli issued by the DUT. In response to detecting the stimuli, the microcontroller may send control signals to the antenna tuning elements to configure the antenna circuitry in different modes. Each of the different modes may be optimized to test a selected one of the multiple antennas in the DUT when operating using different radio access technologies and at different frequencies.

Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.