Patents by Inventor Erica Porras
Erica Porras has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8020750Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.Type: GrantFiled: October 24, 2006Date of Patent: September 20, 2011Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 8017028Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: October 14, 2008Date of Patent: September 13, 2011Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7850786Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.Type: GrantFiled: October 17, 2006Date of Patent: December 14, 2010Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7559527Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: April 19, 2007Date of Patent: July 14, 2009Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7517469Abstract: Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free stream extends from an upstream location near the nozzle to a downstream location. The stream is marked at the upstream location and measured at the downstream location to determine the flow.Type: GrantFiled: April 28, 2006Date of Patent: April 14, 2009Assignee: Sokudo Co., Ltd.Inventors: Harald Herchen, Erica Porras, Tetsuya Ishikawa
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Patent number: 7497026Abstract: A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.Type: GrantFiled: June 14, 2007Date of Patent: March 3, 2009Assignee: Sokudo Co., Ltd.Inventors: Harald Herchen, Lily Pang, Erica Porras
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Patent number: 7459003Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: October 3, 2006Date of Patent: December 2, 2008Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7448276Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.Type: GrantFiled: August 23, 2006Date of Patent: November 11, 2008Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Publication number: 20080168673Abstract: A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.Type: ApplicationFiled: June 14, 2007Publication date: July 17, 2008Applicant: SOKUDO CO., LTD.Inventors: Harald Herchen, Lily Pang, Erica Porras
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Publication number: 20070251921Abstract: Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free stream extends from an upstream location near the nozzle to a downstream location. The stream is marked at the upstream location and measured at the downstream location to determine the flow.Type: ApplicationFiled: April 28, 2006Publication date: November 1, 2007Applicant: APPLIED MATERIALS, INC.Inventors: Harald HERCHEN, Erica PORRAS, Tetsuya ISHIKAWA
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Publication number: 20070226973Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: April 19, 2007Publication date: October 4, 2007Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
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Publication number: 20070200082Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: April 20, 2007Publication date: August 30, 2007Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
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Publication number: 20070113663Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: August 23, 2006Publication date: May 24, 2007Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
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Publication number: 20070062909Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.Type: ApplicationFiled: October 17, 2006Publication date: March 22, 2007Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
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Publication number: 20070062021Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: October 24, 2006Publication date: March 22, 2007Inventors: Mark Crockett, John Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
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Publication number: 20070051080Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: October 3, 2006Publication date: March 8, 2007Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed