Patents by Inventor Erica Porras

Erica Porras has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8020750
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: September 20, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 8017028
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: September 13, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7850786
    Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.
    Type: Grant
    Filed: October 17, 2006
    Date of Patent: December 14, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7559527
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: July 14, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7517469
    Abstract: Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free stream extends from an upstream location near the nozzle to a downstream location. The stream is marked at the upstream location and measured at the downstream location to determine the flow.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: April 14, 2009
    Assignee: Sokudo Co., Ltd.
    Inventors: Harald Herchen, Erica Porras, Tetsuya Ishikawa
  • Patent number: 7497026
    Abstract: A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: March 3, 2009
    Assignee: Sokudo Co., Ltd.
    Inventors: Harald Herchen, Lily Pang, Erica Porras
  • Patent number: 7459003
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: December 2, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7448276
    Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: November 11, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Publication number: 20080168673
    Abstract: A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.
    Type: Application
    Filed: June 14, 2007
    Publication date: July 17, 2008
    Applicant: SOKUDO CO., LTD.
    Inventors: Harald Herchen, Lily Pang, Erica Porras
  • Publication number: 20070251921
    Abstract: Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free stream extends from an upstream location near the nozzle to a downstream location. The stream is marked at the upstream location and measured at the downstream location to determine the flow.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Harald HERCHEN, Erica PORRAS, Tetsuya ISHIKAWA
  • Publication number: 20070226973
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: April 19, 2007
    Publication date: October 4, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070200082
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: April 20, 2007
    Publication date: August 30, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070113663
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: August 23, 2006
    Publication date: May 24, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070062909
    Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.
    Type: Application
    Filed: October 17, 2006
    Publication date: March 22, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070062021
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: October 24, 2006
    Publication date: March 22, 2007
    Inventors: Mark Crockett, John Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070051080
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: October 3, 2006
    Publication date: March 8, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed