Abstract: An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

Abstract: An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

Abstract: An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Abstract: A vertical laminated electrical switch circuit includes a first, second, and third ceramic substrate positioned in juxtaposed relationship relative to each other. The circuit also includes a first and second electrical device electrically coupled to each other. The first electrical device is coupled to the first and second substrates and positioned there between. The second electrical device is coupled to the second and third ceramic substrates and positioned there between. In some embodiments, multiple electrical devices may be coupled to a single substrate.

Abstract: An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT. etc. are positioned between a pair of ceramic substrate members. Layers of solderable material are directly bonded to the inner and outer surfaces of the substrate members.