Patents by Inventor Erich Haidinger

Erich Haidinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4413409
    Abstract: Method for attaching and fastening parallel current lead wires to opposite lateral surfaces of an electrical component wherein current lead wires formed in one piece in the shape of a U are disposed in continuous sequence on a belt-shaped conveyor-carrier of an automatically operating assembly system so that part of the two legs of the U-shaped structure and the part of the U-shaped structure connecting the legs protrude laterally beyond the edge of the conveyor-carrier, and an electrical component is clamped between the two legs and soldered thereto, which includes the steps of:(a) forming bends in the legs of U-shaped parallel current lead wires so as to adjust the mutual spacing of the legs in the part thereof projecting beyond the edge of the conveyor-carrier so that the spacing is smaller than is the length of the electrical component to be clamped between the legs, and the mutual spacing of the centers of the cross sections of the legs is greater than is the length of the electrical component,(b) insert
    Type: Grant
    Filed: June 9, 1981
    Date of Patent: November 8, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventor: Erich Haidinger
  • Patent number: 4341013
    Abstract: A method is disclosed for attaching and securing power supply leads to electrical components including ceramic multi-layer capacitors. A tape-shaped transport carrier is continuously provided with power supply leads having a U-shaped portion projecting over the edge of the transport carrier. The U-shaped portion is bent up to form a loop and is then provided with bends. The U-shaped connection part is bent down approximately 90.degree. so that the front bends form an insertion aid for the insertion of the components between the supply leads. A solder operation then follows.
    Type: Grant
    Filed: October 10, 1980
    Date of Patent: July 27, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventor: Erich Haidinger