Patents by Inventor Erich K. Laetsch

Erich K. Laetsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6798878
    Abstract: A design for passively cooled telecommunication repeater housings for use in wire transmission in the local loop outside plant provides mounting slots for repeaters and voltage protector assemblies disposed and arranged such that a repeater and its voltage protector assembly can be removed independently of each other by pulling either one in the same direction.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: September 28, 2004
    Assignee: Anacapa Technology, Inc.
    Inventor: Erich K. Laetsch
  • Publication number: 20040022385
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Application
    Filed: November 27, 2002
    Publication date: February 5, 2004
    Inventor: Erich K. Laetsch
  • Publication number: 20030156708
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Application
    Filed: November 26, 2002
    Publication date: August 21, 2003
    Inventor: Erich K. Laetsch
  • Publication number: 20030078015
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis for a thermally enhanced center housing of an 818/819 style repeater housing includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. The thermal collection, transfer and distribution members can be integrated into a thermal chassis.
    Type: Application
    Filed: November 26, 2002
    Publication date: April 24, 2003
    Inventor: Erich K. Laetsch
  • Patent number: 6535603
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: March 18, 2003
    Assignee: Anacapa Technology, Inc.
    Inventor: Erich K. Laetsch
  • Publication number: 20030026415
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis for a thermally enhanced center housing of an 818/819 style repeater housing includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. The thermal collection, transfer and distribution members can be integrated into a thermal chassis.
    Type: Application
    Filed: February 1, 2002
    Publication date: February 6, 2003
    Inventor: Erich K. Laetsch
  • Patent number: 6510223
    Abstract: An improved service access and heat transfer design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by a cover, sealable to the housing's sidewall, removable to provide field replaceable, plug-in access to the repeater modules and voltage protector assemblies wherein the voltage protector assemblies can be installed and removed without first removing the repeater modules protected by those voltage protector assemblies and by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. Thermal sleeves, which mount the repeater modules, collect the repeater modules' waste heat through thermal interfaces, transfer the waste heat along thermal conduction paths to the housing's sidewalls, and then distribute the waste heat over a substantial portion of the housing's sidewalls.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: January 21, 2003
    Assignee: Anacapa Technology, Inc.
    Inventor: Erich K. Laetsch
  • Publication number: 20020085354
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Application
    Filed: February 8, 2001
    Publication date: July 4, 2002
    Inventor: Erich K. Laetsch
  • Publication number: 20020050798
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Application
    Filed: September 14, 2001
    Publication date: May 2, 2002
    Inventor: Erich K. Laetsch
  • Patent number: 6292556
    Abstract: An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: September 18, 2001
    Assignee: Anacapa Technology, Inc.
    Inventor: Erich K. Laetsch