Abstract: The invention relates to a method for monitoring the breakdown of a pn junction in a semiconductor component and to a semiconductor component adapted to carrying out said method. According to the method, optical radiation which is emitted if a breakdown occurs on a pn junction is detected by a photosensitive electronic component (8) integrated into the semiconductor component. The supply of the pn junction is controlled according to the detected radiation to prevent a complete breakdown during operation of the semiconductor component. The method according to the invention and the semiconductor component adapted thereto permit the operating range of the semiconductor component to be extended and the power output to be increased without the risk of destruction.

Abstract: The invention relates to a method for monitoring the breakdown of a pn junction in a semiconductor component and to a semiconductor component adapted to carrying out said method. According to the method, optical radiation which is emitted if a breakdown occurs on a pn junction is detected by a photosensitive electronic component (8) integrated into the semiconductor component. The supply of the pn junction is controlled according to the detected radiation to prevent a complete breakdown during operation of the semiconductor component. The method according to the invention and the semiconductor component adapted thereto permit the operating range of the semiconductor component to be extended and the power output to be increased without the risk of destruction.

Abstract: A controllable damping member has a substrate with a semiconductor material; a coplanar conductor applied on the substrate and having a metalization; and a control voltage applied between the metalization of the coplanar conductor and the semiconductor material of the substrate and determining a damping of the coplanar conductor.

Abstract: A planar waveguide structure for mm-wave transmitters and receivers. The active semiconductor component elements and the planar waveguide with which they are connected of the transmitters and/or receivers are arranged on the front side of a semiconductor substrate. The rear side or surface of the semiconductor substrate is at least partially formed as an inwardly or outwardly radiating surface and is geometrically shaped such that an electromagnetic property incident or emanating radiation is altered in a predetermined manner.

Abstract: The invention relates to a method in particular for manufacturing bipolar transistors. By applying selective epitaxy methods and by using self-adjusting techniques, the process sequence is shortened and the transistor properties are improved.

Abstract: A process for producing monolithically integrated multifunction circuit arrangements. A substrate having an integrated circuit formed therein is provided, and further multilayer semiconductor components and the corresponding electrical leads are arranged on top of one another on the substrate surface. The multilayer semiconductor components and the electrical leads are produced from an epitaxially grown semiconductor layer sequence.

Abstract: The invention relates to CCD Si detector configuration with a semiconductor sensibilizator. The spectral range of the detectors extends from 0.4 .mu.m to 1.6 .mu.m. The CCD Si detector configuration is produced as integrated structure so that a large picture element number can be achieved. The semiconductor layer sequence of the semiconductor sensibilizator is grown using differential molecular beam epitaxial growth techniques.

Abstract: A structured semiconductor body e.g., an integrated circuit or a transistor, based on an silicon substrate having barrier regions which contain polycrystalline silicon, preferably produced by a silicon MBE process. The barrier regions are required to delimit monocrystalline silicon semiconductor regions and/or structures to prevent undesirable current flow.

Abstract: A structured semiconductor body based on a Si substrate and having monocrystalline semiconductor regions and barrier regions which contain polycrystalline silicon which have preferably been produced in an Si-MBE process. The barrier regions are provided to delimit the monocrystalline Si semiconductor structures to prevent undesired current flow, for example between two monocrystalline devices of an integrated circuit. The polycrystalline silicon of the barrier regions has a substantially lower electrical conductivity than the monocrystalline regions, and consequently it is possible to spatially selectively dope portions the barrier region so as to provide regions which electrically contact a monocrystalline silicon region. In a preferred embodiment a polycrystalline silicon region within the barrier region is doped so that it forms a pn-junction with the adjacent monocrystalline semiconductor region and can be used, for example, as an emitter zone of a bipolar device.

Abstract: A structured semiconductor body based on a Si substrate and having monocrystalline semiconductor regions and barrier regions which contain polycrystalline silicon which have preferably been produced in an Si-MBE process. The barrier regions are provided to delimit the monocrystalline Si semiconductor structures to prevent undesired current flow, for example between twso monocrystalline devices of an integrated circuit. The polycrystalline silicon of the barrier regions has a substantially lower electrical conductivity than the monocrystalline regions, and consequently it is possible to spatially selectively dope portions the barrier region so as to provide regions which electrically contact a monocrystalline silicon region. In a preferred embodiment a polycrystalline silicon region within the barrier region is doped so that it forms a pn-junction with the adjacent monocrystalline semiconductor region and can be used, for example, as an emitter zone of a bipolar device.

Abstract: A composite semiconductor/glass material comprising at least one semiconductor layer permanently connected to a plate shaped glass substrate, the doping of the semiconductor layer rising from a minimum at its surface away from the glass substrate to a maximum adjacent the glass substrate.

Abstract: A semiconductor-glass composite material comprises at least one semiconductor bonded to a glass substrate, with the semiconductor layer having a strain .epsilon..ltoreq.0.3 per mil, and a dislocation density N.sub.V .ltoreq.2.times.10.sup.6 cm.sup.-2. In a process for producing the semiconductor-glass composite material, the semiconductor and glass are heated to a bonding temperature, bonded under pressure, and tempered at a temperature T.sub.a such that the viscosity of the glass at T.sub.a is 10.sup.12 to 10.sup.13.5 poise, and the following relationship holds: ##EQU1## wherein .alpha..sub.G and .alpha..sub.S are the coefficients of expansion of the glass and semiconductor, respectively, and T is temperature. The composite material is then cooled to room temperature.

Abstract: In a method of manufacturing a semiconductor/glass composite material, a glass substrate is covered partially by a covering layer, a semiconductor is connected by pressure and heat to the surface of the substrate not covered by the covering layer, and the semiconductor is then etched away by means of etch polishing to the thickness of the covering layer. The covering may be silicon dioxide, and may be applied to substrate by sputtering or by deposition from the gas phase. The etching solution is NH.sub.4 OH and H.sub.2 O.sub.2 in the ratio 700 to 1.The composite material may be used as a photocathode in an image converter or image intensifier tube.

Abstract: Chemically resistant steels for containers are butt welded by using an automatic welding process. The electrode is oscillated over the whole width of the seam and is kept to a maximum thickness of 1 mm.