Abstract: A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.

Abstract: A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.

Abstract: A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.

Abstract: A printing screen for use through-plating a printed circuit board. The printing screen has at least one screen hole for filling a larger hole compared to a reference hole in a ceramic substrate. This printing screen has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.

Abstract: A printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, having conductor tracks formed on two sides of a ceramic substrate. The ceramic substrate has at least one metalized hole for through-contacting that connects the conductor tracks to one another. The hole of the sintered ceramic substrate is filled with a metal-containing sintering paste, which is introduced under pressure. In the fully sintered state, the paste enters into at least one integral bond with the ceramic substrate and completely fills the hole in so doing.

Abstract: A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.

Abstract: A sensor, such as an electrostatic particle sensor, having a housing in which a sensor element is disposed, and a gas-tight electrical feedthrough through the housing, the feedthrough being configured for directing electrical currents and/or voltages from electrical components that are disposed outside the housing into the housing and/or out of the housing. In order for a sensor which permanently has at least one gas-tight electrical feedthrough through the housing thereof to be provided, the electrical feedthrough has a ceramic molded body which has at least one through bore, the latter having a first end and a second end, wherein the through bore from the first end up to the second end is filled with a metallic paste, and the ceramic molded body in a sintering process is connected to the metallic paste, and in the region of the first end and/or of the second end of the through bore at least one metallic tube piece is attached to the sintered metallic paste.

Abstract: A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.

Abstract: A fill level sensor for a fuel tank of a motor vehicle includes electrical structures that consist of different materials. Sliding contact track structures exposed to the fuel consist of a gold-containing paste. Conductor structures are protected by a cover from contact with the fuel and consist of an especially inexpensive material. The fill level sensor therefore is highly resistant to corrosive fuels and can be produced at low cost.

Abstract: An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor.

Abstract: An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor.

Abstract: A tank sensor circuit board for a fill level sensor in a vehicle tank, including a support element, on which contact surfaces containing silver are applied using thick layer technology. The contact surfaces are made up of a silver layer and a top layer containing nickel, palladium and gold, completely or partly covering the silver layer.

Abstract: A tank sensor circuit board for a fill level sensor in a vehicle tank, including a support element, on which contact surfaces containing silver are applied using thick layer technology. The contact surfaces are made up of a silver layer and a top layer containing nickel, palladium and gold, completely or partly covering the silver layer.

Abstract: A force sensor includes a diaphragm-like carrier made of ceramic. Arranged on the carrier are thick-film resistors and a circuit of strain-sensitive thick-film conductor tracks, which are formed in particular as a Wheatstone bridge connecting the thick-film resistors to one another. A dielectric layer is arranged between the carrier and the thick-film resistors 5.

Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: A force sensor includes a diaphragm-like carrier made of ceramic. Arranged on the carrier are thick-film resistors and a circuit of strain-sensitive thick-film conductor tracks, which are formed in particular as a Wheatstone bridge connecting the thick-film resistors to one another. A dielectric layer is arranged between the carrier and the thick-film resistors 5.

Abstract: A pressure sensor includes a membrane having a radially peripheral edge region fixedly arranged on a support. One side of the membrane can be acted on by a medium being measured and the membrane can be deflected in response to pressure of the medium. Measuring elements and an electric circuit interconnecting the measuring elements are arranged on the membrane, the measuring elements and the circuit being applied by the thick-film technique and sintered on in a thermal process. The membrane is made of an electrically conducting metal and bears an insulating layer, on which the measuring elements and the electric circuit are arranged. In this case, the insulating layer consists of a material having a coefficient of expansion that lies between the coefficient of expansion of the metal of the membrane and the coefficient of expansion of the material of the measuring elements and the electric circuit.