Patents by Inventor Erich Pischler

Erich Pischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilevel interconnection system
    Patent number: 8888504
    Abstract: A male connection component (120) for connection with a correspondingly configured female connection component (140) having a recess (144) extending into a main surface (170) of a female Substrate (142) of the female connection component (140), wherein the female connection component (140) comprises a plurality of electrically conductive female contacts (146) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (170) of the female Substrate (142), the male connection component (120) comprising a male Substrate (102), a Protrusion (104) protruding from a main surface (160) of the male Substrate (102) and comprising a plurality of electrically conductive male contacts (106) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (160) of the male Substrate (102), wherein the male connection component (120) is adapted for connection with the female connection component (1
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: November 18, 2014
    Assignee: NXP B.V.
    Inventor: Erich Pischler
  • MULTILEVEL INTERCONNECTION SYSTEM
    Publication number: 20120045909
    Abstract: A male connection component (120) for connection with a correspondingly configured female connection component (140) having a recess (144) extending into a main surface (170) of a female Substrate (142) of the female connection component (140), wherein the female connection component (140) comprises a plurality of electrically conductive female contacts (146) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (170) of the female Substrate (142), the male connection component (120) comprising a male Substrate (102), a Protrusion (104) protruding from a main surface (160) of the male Substrate (102) and comprising a plurality of electrically conductive male contacts (106) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (160) of the male Substrate (102), wherein the male connection component (120) is adapted for connection with the female connection component (1
    Type: Application
    Filed: March 26, 2010
    Publication date: February 23, 2012
    Applicant: NXP B.V.
    Inventor: Erich Pischler