Patents by Inventor Erich Theado
Erich Theado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170098529Abstract: A RFID tag containment combination for a sputter target/backing plate assembly. A bore is provided in either the target or the backing plate and is adapted for snug receipt of a plug therein. The plug comprises a recessed portion thereof configured to carry the RFID tag therein.Type: ApplicationFiled: May 13, 2015Publication date: April 6, 2017Inventors: Justin K. Reed, Erich Theado, Kenneth Fielder, Gerald Stevens, Ronald Alan Dilley, John Hardy Burley
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Publication number: 20170084434Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.Type: ApplicationFiled: November 30, 2016Publication date: March 23, 2017Inventors: Weifang Miao, David B. Smathers, Eugene Y. Ivanov, Erich Theado, Robert S. Bailey, Jeff Hart
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Patent number: 9546418Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.Type: GrantFiled: February 9, 2012Date of Patent: January 17, 2017Assignee: Tosoh SMD, Inc.Inventors: Weifang Miao, David B. Smathers, Eugene Y. Ivanov, Erich Theado, Robert S. Bailey, Jeff Hart
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Publication number: 20140034490Abstract: A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al inter-layer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.Type: ApplicationFiled: February 9, 2012Publication date: February 6, 2014Applicant: TOSOH SMD, INCInventors: Weifang Miao, David B. Smathers, Eugene Y. Ivanov, Erich Theado, Robert S. Bailey, Jeff Hart
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Patent number: 8453487Abstract: A method of making metal target blank using circular groove pressing includes pressing a metal or metal alloy target blank in a first circular grooved pressing die set into a first concentric corrugated shape while maintaining an original diameter of the target blank to create concentric rings of shear deformation in the target blank. Forces are then applied to the concentric corrugated target blank sufficient to substantially flatten the target blank with a flat die set while maintaining the original diameter of the target blank to restore the target blank to a substantially flat condition. The target blank is pressed in a second circular grooved die set into a second concentric corrugated shape while maintaining the original diameter of the target blank, wherein the second die set has a groove pattern offset from a groove pattern of the first die set so as to create concentric rings of shear deformation in areas of the target blank which were not previously deformed.Type: GrantFiled: October 9, 2009Date of Patent: June 4, 2013Assignee: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Erich Theado, David B. Smathers
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Patent number: 8235277Abstract: A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target to a high strength backing plate and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.Type: GrantFiled: September 13, 2011Date of Patent: August 7, 2012Assignee: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Erich Theado
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Publication number: 20120000594Abstract: A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target to a high strength backing plate and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.Type: ApplicationFiled: September 13, 2011Publication date: January 5, 2012Applicant: TOSOH SMD, INC.Inventors: Eugene Y. Ivanov, Erich Theado
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Patent number: 8020748Abstract: A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target (100) to a high strength backing plate (110) and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.Type: GrantFiled: August 8, 2007Date of Patent: September 20, 2011Assignee: Toso SMD, Inc.Inventors: Eugene Y. Ivanov, Erich Theado
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Publication number: 20110219847Abstract: A method of making metal target blank using circular groove pressing includes pressing a metal or metal alloy target blank in a first circular grooved pressing die set into a first concentric corrugated shape while maintaining an original diameter of the target blank to create concentric rings of shear deformation in the target blank. Forces are then applied to the concentric corrugated target blank sufficient to substantially flatten the target blank with a flat die set while maintaining the original diameter of the target blank to restore the target blank to a substantially flat condition. The target blank is pressed in a second circular grooved die set into a second concentric corrugated shape while maintaining the original diameter of the target blank, wherein the second die set has a groove pattern offset from a groove pattern of the first die set so as to create concentric rings of shear deformation in areas of the target blank which were not previously deformed.Type: ApplicationFiled: October 9, 2009Publication date: September 15, 2011Applicant: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Erich Theado, David B. Smathers
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Publication number: 20110139614Abstract: A sputtering plasma reactors for plasma vapor deposition (PVD) having an improved interface between a PVD target, a ceramic ring and a PVD chamber wall. The reactor includes a PVD chamber wall and a PVD target, wherein the target in conjunction with the PVD chamber wall form a vacuum chamber and wherein at least the portion of the target facing the vacuum chamber is composed of material to be sputtered. The reactor also includes an insulating ceramic ring positioned between the target and the PVD chamber wall. A first O-ring is provided to establish a vacuum seal between the target and the insulating ring and a second O-ring is provided to establish a vacuum seal between the insulating ring and the PVD chamber wall. At least one spacer is positioned between the target and insulating ring to maintain a gap G between the insulating ring and the target.Type: ApplicationFiled: February 21, 2011Publication date: June 16, 2011Applicant: TOSOH SMD, INC.Inventors: Eugene Y. Ivanov, Erich Theado, Harry W. Conard, John E. Poole
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Patent number: 7922881Abstract: A sputtering plasma reactors for plasma vapor deposition (PVD) having an improved interface between a PVD target, a ceramic ring and a PVD chamber wall. The reactor includes a PVD chamber wall and a PVD target, wherein the target in conjunction with the PVD chamber wall form a vacuum chamber and wherein at least the portion of the target facing the vacuum chamber is composed of material to be sputtered. The reactor also includes an insulating ceramic ring positioned between the target and the PVD chamber wall. A first O-ring is provided to establish a vacuum seal between the target and the insulating ring and a second O-ring is provided to establish a vacuum seal between the insulating ring and the PVD chamber wall. At least one spacer is positioned between the target and insulating ring to maintain a gap G between the insulating ring and the target.Type: GrantFiled: February 28, 2006Date of Patent: April 12, 2011Assignee: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Erich Theado, Harry W. Conard, John E. Poole
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Publication number: 20100044415Abstract: A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target (100) to a high strength backing plate (110) and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.Type: ApplicationFiled: September 8, 2007Publication date: February 25, 2010Applicant: TOSOH SMD, INC.Inventors: Eugene Y. Ivanov, Erich Theado
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Publication number: 20080164146Abstract: A sputtering plasma reactors for plasma vapor deposition (PVD) having an improved interface between a PVD target, a ceramic ring and a PVD chamber wall. The reactor includes a PVD chamber wall and a PVD target, wherein the target in conjunction with the PVD chamber wall form a vacuum chamber and wherein at least the portion of the target facing the vacuum chamber is composed of material to be sputtered. The reactor also includes an insulating ceramic ring positioned between the target and the PVD chamber wall. A first O-ring is provided to establish a vacuum seal between the target and the insulating ring and a second O-ring is provided to establish a vacuum seal between the insulating ring and the PVD chamber wall. At least one spacer is positioned between the target and insulating ring to maintain a gap G between the insulating ring and the target.Type: ApplicationFiled: February 28, 2006Publication date: July 10, 2008Applicant: TOSOH SMD, INC.Inventors: Eugene Y. Ivanov, Erich Theado, Harry W. Conard, John E. Poole