Patents by Inventor Erick Dahilig

Erick Dahilig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit encapsulation system with vent
    Patent number: 7482683
    Abstract: An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: January 27, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Antonio B. Dimaano, Jr., Erick Dahilig, Sheila Marie L. Alvarez, Robinson Quiazon, Jose Alvin Caparas
  • INTEGRATED CIRCUIT ENCAPSULATION SYSTEM WITH VENT
    Publication number: 20070262423
    Abstract: An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 15, 2007
    Applicant: STATS ChipPAC Ltd.
    Inventors: Antonio Dimaano, Erick Dahilig, Sheila Marie Alvarez, Robinson Quiazon, Jose Caparas