Abstract: A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

Abstract: An electrical control device including at least one power module which further includes at least one controlled power switch, at least one control card attached to the power module, and electrical connection which connect the control card to the control module. The electrical connection includes at least one pin which is electrically connected and extends from the power module, or, respectively, the control card, and at least one receptacle which is electrically connected and mounted on the control card, or, respectively, the power module, the pin being inserted, at least partially, into the receptacle. The pin and the receptacle is designed to provide an electrical connection between them whilst allowing the pin to be removed from the receptacle.

Abstract: An electrical control device including at least one power module which further includes at least one controlled power switch, at least one control card attached to the power module, and electrical connection which connect the control card to the control module. The electrical connection includes at least one pin which is electrically connected and extends from the power module, or, respectively, the control card, and at least one receptacle which is electrically connected and mounted on the control card, or, respectively, the power module, the pin being inserted, at least partially, into the receptacle. The pin and the receptacle is designed to provide an electrical connection between them whilst allowing the pin to be removed from the receptacle.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: The invention relates to a process for soldering an electronic component onto a support comprising at least one heat drain for the said component, using solder paste incorporating a stripping flux activated at a first temperature, and a solder alloy melting at a second temperature. The process is characterised by the fact that it consists of: preheating the support on the face opposite the component through the heat drain up to the said first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature. The invention also relates to an installation for implementing the process. It is also used for the repair of an electronic card by replacing defective elements without the risk of unsoldering or damaging adjacent elements.