Patents by Inventor Erick Spory

Erick Spory has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board interconnecting structure with compliant cantilever interposers
    Patent number: 8466371
    Abstract: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: June 18, 2013
    Inventor: Erick Spory
  • Printed Circuit Board Interconnecting Structure With Compliant Cantilever Interposers
    Publication number: 20090120678
    Abstract: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 14, 2009
    Inventor: Erick Spory