Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Abstract: An air flow redirection device is disclosed. The air flow redirection device comprises a frame with a main hinge coupled to a top back edge of the frame. A plate is coupled to the main hinge and configured to rotate about the main hinge from an open position to a closed position. In the closed position the plate rests on top of the frame with a bottom side of the plate facing the bottom of the frame. A plurality of blocking fingers are coupled to the bottom side of the plate using a secondary hinge in a line parallel with, and adjacent to, the primary hinge. Each blocking finger is spring loaded away from the plate.

Abstract: A spring apparatus comprises a substantially linear first segment and a substantially linear center segment, rotatably connected to the first segment by a first bend. A substantially linear second segment is rotatably connected to the center segment by a second bend and has a terminal end spaced apart from the second bend. The terminal end contacts the first segment in a slidable manner as at least one of the second segment and the center segment rotates relative to the first segment to release stored energy.

Abstract: A computer according to a preferred embodiment of the invention may have a power supply mounted therein without the use of tool-requiring fasteners. A chassis of the computer may have a chassis hook and either a stop or an elastic catch. A power supply of the computer may have a power supply hook and either an elastic catch or a stop. When the power supply is mounted to the chassis, the power supply hook engages the chassis hook, and the elastic catch engages the stop in a manner that prevents the power supply hook from disengaging from the chassis hook.

Abstract: A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections.

Abstract: A system and method that enables installation of media devices in a chassis. The chassis has an internal cavity defined by a plurality of walls. Additionally, a first media device has a first external width dimension and a second media device has a second external width dimension. The second external width dimension is different than the first external width dimension. A plurality of mounting features are connected to the plurality of walls to hold the first media device and the second media device in a plurality of orientations relative to the chassis.