Abstract: A device for capturing data in the region of a digital camera. Within a camera housing, electronic components are arranged on at least two printed circuit boards. The circuit boards are joined to form a stack. At least one recess is formed in the region of at least one circuit board on the side associated with another circuit board, to receive components arranged on another circuit board. The digital camera optionally has at least one contour milling in the region of a circuit board for height compensation relative to the image sensor in the digital camera. The mechanical securing mechanism of a connection device of an interface into a fastening element connected to the circuit board stack is integrated with the connecting of the housing parts by a preloaded clip. A method for electrical contacting, by which essential parts of the device for capturing data can be produced.

Abstract: An imaging unit of a camera for recording the surroundings has an image sensor with a lens for the display of the surroundings on the image sensor. The image sensor and the lens are held by a carrier. The camera additionally has a circuit hoard and at least the signal and the supply lines of the image sensor arranged on the carrier. The image sensor is mounted on a carrier substrate, which similar to the lens, is arranged on the carrier at a distance from the circuit board, and has a flexible electrical connection to the circuit board.

Abstract: An imaging unit of a camera for recording the surroundings has an image sensor with a lens for the display of the surroundings on the image sensor. The image sensor and the lens are held by a carrier. The camera additionally has a circuit board and at least the signal and the supply lines of the image sensor arranged an the carrier. The image sensor is mounted an a carrier substrate, which similar to the lens, is arranged on the carrier at a distance from the circuit board, and has a flexible electrical connection to the circuit board.

Abstract: A sensor and a corresponding method for the determination of the incidence angle of a radiation source are provided. The sensor has a diode assembly of avalanche photodiodes in a semiconductor layer and an application specific integrated circuit, a distance layer, an aperture structure located on the distance layer, and contacts for electrically connecting the sensor. The layers and structures are positioned directly on top of each other and match in their shape, size or thickness.

Abstract: A stereoscopic camera for recording the surroundings is provided with a right and a left image sensor having one lens each to display the surroundings on the image sensors, with the image sensors and the lenses being held by a carrier side-by-side and at a distance in reference to each other. The stereoscopic camera is additionally provided with a circuit board arranged on the carrier and comprising at least the signal and the supply lines of both image sensors. The image sensors are each mounted on a carrier substrate, which similar to the lenses, are arranged on the carrier and are distanced in reference to the circuit board, and have a flexible electric connection to the circuit board.

Abstract: A method and device to control electrical devices using motion detection are presented, through which an object inside a monitoring area which is subdivided into a pre-detection area and a detection area is successively identified as well as verified in the detection area for reducing power input in standby mode and during operation in the main cycle using distance measurements and its position consequently determined. During the course of the distance measurements, the control device is brought into a readiness state and later on into operating state. After finishing the distance measurements and determining the position of the object in the detection area, an output signal which serves to control an external electrical device is generated by a control device.

Abstract: An image acquisition device of a camera that has an electronic sensor chip, electrically connected to a circuit board, includes an objective situated in an objective carrier, and oriented in regard to situation and inclination in relation to an imager surface of the sensor chip. The situation and inclination of the objective are defined by a contact surface of the objective carrier. The contact surface of the objective carrier lies flat on the sensor chip, so that the imager surface is not covered by the contact surface.