Patents by Inventor Erik COOLEN

Erik COOLEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inkjet printhead having robust encapsulation of wirebonds
    Patent number: 11701883
    Abstract: An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: July 18, 2023
    Assignee: Memjet Technology Limited
    Inventors: Elmer Dimaculangan Perez, See-Huat Tan, Glenn Horrocks, Mohammad Hossain, Michael John Webb, Pascal Blanquer, Erik Coolen
  • INKJET PRINTHEAD HAVING ROBUST ENCAPSULATION OF WIREBONDS
    Publication number: 20220048289
    Abstract: An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.
    Type: Application
    Filed: August 11, 2021
    Publication date: February 17, 2022
    Inventors: Elmer Dimaculangan PEREZ, See-Huat TAN, Glenn HORROCKS, Mohammad HOSSAIN, Michael John WEBB, Pascal BLANQUER, Erik COOLEN