Abstract: A method for bonding two confronting electronic devices together wherein the two electronic devices are initially temporarily coupled together using a room temperature process with a plurality of knife-edge microstructures on at least a first one of the electronic devices engaging portions of the a second one of the electronic devices. The room temperature process involves applying a relatively low compressive force or pressure between the two electronic devices compared to the forces or pressures used in convention flip-chip bonding. The first one of the electronic devices and the second one of the electronic devices also have traditional contact pads that are spaced from each other by a standoff distance when the devices are initially coupled together using the room temperature process. This allows for inspection of the two electronic devices while they are initially temporarily coupled together.

Abstract: Techniques for bisecting a symmetric, substantially transmissive two-port network (a THRU structure) through an optimization solution of the relevant equations defined by transmission matrix mathematics are described. Bisect de-embedding may be performed using a single substantially symmetric THRU structure, a first half of a first substantially symmetric THRU structure and a second half of a second substantially symmetric THRU structure, and by combining bisect de-embedding with conventionally known de-embedding techniques.