Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis through the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 121. Within the light-conducting channel 121 a lens 112 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 122 of the light-conducting channel 121. The image sensor 113 is provided with an image pick-up section 114, which is oriented perpendicularly to the optical axis 106. Near the end 122 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image pick-up section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means.

Abstract: The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 122. Within the light-conducting channel 122 a lens 120 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 128 of the light-conducting channel 122. The image sensor 113 is provided with an image section 114, which is oriented perpendicularly to the optical axis 106. Near the end 128 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means.

Abstract: Device (1) and method for testing an electronic component (21), which device comprises a testing mechanism (2) and a mounting mechanism (3) comprising a component contact surface (14) on a side remote from the testing mechanism (2), wherein the component contact surface is provided with a vacuum chamber connected to a vacuum means (19). The mounting mechanism is provided with a heating element (24), by means of which the component contact surface can be heated.