Patents by Inventor Erik H. Engdahl
Erik H. Engdahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6729945Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.Type: GrantFiled: March 30, 2001Date of Patent: May 4, 2004Assignee: Lam Research CorporationInventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl
-
Patent number: 6716093Abstract: An assembly for holding a substrate in a chemical mechanical planarization (CMP) apparatus is provided. The assembly includes a holder frame insertable into the chemical mechanical planarization apparatus, the holder frame having an inner wall. The assembly further includes at least one rolling mechanism rotatably mounted in the holder frame such that at least a portion of the rolling mechanism protrudes from the inner wall. The assembly also includes a wafer chuck movably mounted in the holder frame, the wafer chuck having a first side shaped to substantially conform to the inner wall and to be in continuous contact with the at least one rolling mechanism during planarization, and a second side adapted to receive a substrate for planarization. Also provided are an improved assembly for holding a substrate in a CMP apparatus and a method for reducing friction in a gimbaling mechanism of a wafer chuck in a wafer holder in a CMP apparatus during planarization.Type: GrantFiled: December 7, 2001Date of Patent: April 6, 2004Assignee: Lam Research CorporationInventors: Erik H. Engdahl, Michael D. Steiman, Paul H. Stasiewicz, Jr.
-
Publication number: 20030109208Abstract: An assembly for holding a substrate in a chemical mechanical planarization (CMP) apparatus is provided. The assembly includes a holder frame insertable into the chemical mechanical planarization apparatus, the holder frame having an inner wall. The assembly further includes at least one rolling mechanism rotatably mounted in the holder frame such that at least a portion of the rolling mechanism protrudes from the inner wall. The assembly also includes a wafer chuck movably mounted in the holder frame, the wafer chuck having a first side shaped to substantially conform to the inner wall and to be in continuous contact with the at least one rolling mechanism during planarization, and a second side adapted to receive a substrate for planarization. Also provided are an improved assembly for holding a substrate in a CMP apparatus and a method for reducing friction in a gimbaling mechanism of a wafer chuck in a wafer holder in a CMP apparatus during planarization.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Inventors: Erik H. Engdahl, Michael D. Steiman, Paul H. Stasiewicz
-
Patent number: 6517418Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.Type: GrantFiled: June 22, 2001Date of Patent: February 11, 2003Assignee: Lam Research CorporationInventors: Erik H. Engdahl, Edward T. Ferri, Jr., Wilbur C. Krusell, Rahul Jairath
-
Publication number: 20020146972Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.Type: ApplicationFiled: March 30, 2001Publication date: October 10, 2002Inventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl
-
Patent number: 6336845Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.Type: GrantFiled: November 12, 1997Date of Patent: January 8, 2002Assignee: Lam Research CorporationInventors: Erik H. Engdahl, Edward T. Ferri, Jr., Wilbur C. Krusell, Rahul Jairath, Randall L. Green, Anil Pant
-
Publication number: 20010039168Abstract: A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The system includes an improved process path exchanging a detachable wafer carrying head with spindles at each processing point and conveying the detached wafer carrying heads in a rotary index table between processing points. The system also provides for improved polishing accuracy using linear polishers having pneumatically adjustable belt tensioning and aligning capabilities.Type: ApplicationFiled: June 22, 2001Publication date: November 8, 2001Applicant: Lam Research CorporationInventors: Erik H. Engdahl, Edward T. Ferri, Wilbur C. Krusell, Rahul Jairath
-
Patent number: 6261155Abstract: A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film thickness monitor comprising an interferometer can be disposed alongside the belt or at least partially within a region bound by it. The monitoring channel and the film thickness monitor can be used in the CMP process to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.Type: GrantFiled: March 16, 2000Date of Patent: July 17, 2001Assignee: LAM Research CorporationInventors: Rahul Jairath, Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl
-
Patent number: 6224461Abstract: A temperature compensating unit is coupled to a linearly moving belt of a polisher for adjusting the temperature of the belt, which temperature is measured by a sensor situated proximal to the belt.Type: GrantFiled: March 29, 1999Date of Patent: May 1, 2001Assignee: Lam Research CorporationInventors: Robert G. Boehm, Jr., Anil K. Pant, Wilbur C. Krusell, Erik H. Engdahl
-
Patent number: 6146248Abstract: A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film thickness monitor comprising an interferometer can be disposed alongside the belt or at least partially within a region bound by it. The monitoring channel and the film thickness monitor can be used in the CMP process to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.Type: GrantFiled: May 28, 1997Date of Patent: November 14, 2000Assignee: Lam Research CorporationInventors: Rahul Jairath, Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl
-
Patent number: 5762536Abstract: A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information from the sensors are processed in order to provide feedback for compensating the fluid dispensing when fluid platens are used and/or the downforce exerted by the wafer carrier.Type: GrantFiled: February 6, 1997Date of Patent: June 9, 1998Assignee: Lam Research CorporationInventors: Anil K. Pant, Joseph R. Breivogel, Douglas W. Young, Rahul Jairath, Erik H. Engdahl
-
Patent number: 5618351Abstract: Thermal treatment boat comprising a cylinder having a central axis and a plurality of band slots having opposed upper and lower surfaces in planes perpendicular to said central axis and spaced at predetermined locations along said central axis. At least one slot in each set extends around at least 180.degree. and less than of the full circumference of said cylinder. Pairs of adjacent band slots define an annular band therebetween. The height of each slot being from about 3.8 to 12.7 mm. Each of the bands having a height, Height.sub.Band, in mm, according to the equation: ##EQU1## wherein Height.sub.Band is always .ltoreq. wafer thickness; ColumnHeight is the total height of the cylinder, mm; BandSlotHeight is the height of the slot, mm; and NumberBands is the total number of bands in the treatment boat. The cylinder can include a wafer loading effector slot therethrough in a plane of the central axis extending along the length of the cylinder.Type: GrantFiled: November 28, 1995Date of Patent: April 8, 1997Assignee: Silicon Valley Group, Inc.Inventors: Terry A. Koble, Jr., Anthony Dip, Erik H. Engdahl, Ian R. Oliver, Christopher T. Ratliff