Abstract: Processes are described for making epoxidized fatty acid esters from epoxidized natural fats and oils, wherein low moisture fats and oils are identified and selected or made and used in a transesterification process. The products undergo phase separation, and reduced molar excesses of alcohol may be employed compared to processes not employing a low moisture feedstock.

Abstract: Reduced color epoxidized fatty acid esters are provided which may be used as primary plasticizers for PVC, in replacement of phthalate plasticizers. The reduced color epoxidized fatty acid esters are prepared from natural fats or oils by transesterification and interesterification processes, whereby through the use of borohydride, materials having Pt-Co colors according to ASTM D1209 on the order of 50 and lower are possible.

Abstract: Presently disclosed are high purity unsaturated fatty acid esters with an ester moiety characterized by having from five to seven members in a ring structure, which esters when epoxidized find particular utility as primary plasticizers in flexible polyvinyl halide applications. Also disclosed are processes for making the high purity esters.

Abstract: An improved method is provided for the quantitative analysis of mixtures including various sugars, sugar alcohols and related dehydration products, whereby these are enabled to be effectively and accurately quantitated through gas chromatography, for example, by their derivatization with a carboxylic acid, carboxylic acid anhydride or halide in the presence of a metal triflate catalyst. The method can be carried out at essentially room temperature conditions, with a sufficiently rapid and complete derivatization, even in the presence of substantial amounts of water, that the materials to be quantitated do not substantially break down or degrade and substantially completely accounted for in a derivatized form.

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract: Presently disclosed are high purity unsaturated fatty acid esters with an ester moiety characterized by having from five to seven members in a ring structure, which esters when epoxidized find particular utility as primary plasticizers in flexible polyvinyl halide applications. Also disclosed are processes for making the high purity esters.

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component wherein the polyimide has a glass transition temperature of at least 190° C.; wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight; wherein the polyimide has less than 15 molar % of structural units derived from a member selected from the group consisting of biphenyltetracarboxylic acid, a dianhydride of biphenyltetracarboxylic acid, an ester of biphenyltetracarboxylic acid, and a combination thereof.

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract: An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4?-oxydiphthalic anhydride, 3,3?-oxydiphthalic anhydride, 4,4?-oxydiphthalic anhydride, and combinations thereof, and a diamine component. The polyetherimide has a glass transition temperature that is at least 190° C. The film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight. The film has less than 15 molar % of a member selected from the group consisting of biphenyltetracarboxylic acid, dianhydrides of biphenyltetracarboxylic acid, esters of biphenyltetracarboxylic acid, and combinations thereof.

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract: A method for preparing a polymer-organoclay composite composition comprises combining a solvent and an unexfoliated organoclay to provide a first mixture, wherein the unexfoliated organoclay comprises alternating inorganic silicate layers and organic layers, and has an initial spacing between the silicate layers; exposing the first mixture to an energized condition of a sufficient intensity and duration to increase the initial spacing of the inorganic silicate layers, to provide a second mixture; contacting the second mixture with a polymer composition so that the polymer composition fills at least one region located between at least one pair of silicate layers, wherein the polymer composition is at least partially soluble in the solvent; and removing at least a portion of the solvent from the second mixture, wherein the inorganic silicate layers remain separated by the polymer after removal of the solvent.

Abstract: In one embodiment, the present invention provides a method of making a polymer-organoclay composite composition comprising (a) contacting under condensation polymerization conditions a first monomer, a second monomer, a solvent, and an organoclay composition, said organoclay composition comprising alternating inorganic silicate layers and organic layers, to provide a first polymerization reaction mixture, wherein one of said first monomer and second monomers is a diamine and the other is an dianhydride; (b) carrying out a stoichiometry verification step on the first polymerization reaction mixture; (c) optionally adding additional reactant (monomer 1, monomer 2, or chainstopper) to the first polymerization reaction mixture to provide a second polymerization reaction mixture; and (d) removing solvent from the first polymerization reaction mixture or the second polymerization reaction mixture to provide a first polymer-organoclay composite composition comprising a polymer component and an organoclay component w

Abstract: This invention relates to organic salt compositions useful in the preparation of organoclay compositions, polymer-organoclay composite compositions, and methods for the preparation of polymer nanocomposites. In one embodiment, the present invention provides a method of making a polymer-organoclay composite composition, said method comprising melt mixing a quaternary organoclay composition comprising alternating inorganic silicate layers and organic layers, said organic layers comprising a quaternary organic cation with a polymeric resin comprising at least one polymer selected from the group consisting of polyamides, polyesters, polyarylene sulfides, polyarylene ethers, polyether sulfones, polyether ketones, polyether ether ketones, polyphenylenes, and polycarbonates, said polymeric resin being substantially free of polyetherimides; said melt mixing being carried out at a temperature in a range between about 300° C. and about 450° C.

Abstract: This invention relates to organic salt compositions useful in the preparation of organoclay compositions, polymer-organoclay composite compositions, and methods for the preparation of polymer nanocomposites. In one embodiment, the present invention provides a polymer-organoclay composite composition comprising (a) a polymeric resin; and (b) an organoclay composition comprising alternating inorganic silicate layers and organic layers, said organic layers comprising a quaternary phosphonium cation having structure XXXIII wherein Ar12, Ar13, Ar14 and Ar15 are independently C2-C50 aromatic radicals; and Ar16 is a C2-C200 aromatic radical, or a polymer chain comprising at least one aromatic group.

Abstract: An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.

Abstract: Novel antiviral compounds of the formula ##STR1## wherein each of R.sub.1 and R.sub.2, which are the same or different is hydrogen, hydroxy or fluoro; provided that R.sub.1 or R.sub.2 is hydrogen when R.sub.1 and R.sub.2 are different, and provided that R.sub.1 and R.sub.2 are hydroxy or fluoro when R.sub.1 and R.sub.2 are the same; or a physiologically acceptable salt or an optical isomer thereof, methods for their preparation, pharmaceutical preparations containing the compounds, and methods for the treatment of virus infections and other diseases caused by viruses.