Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 121. Within the light-conducting channel 121 a lens 112 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 122 of the light-conducting channel 121. The image sensor 113 is provided with an image pick-up section 114, which is oriented perpendicularly to the optical axis 106. Near the end 122 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image pick-up section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means.

Abstract: A method of manufacturing a back-side (14) illuminated image sensor (1) is disclosed, comprising the steps of: starting with a wafer (2) having a first (3) and a second surface (4), providing light sensitive pixel regions (5) extending into the wafer (2) from the first surface (3), securing the wafer (2) onto a protective substrate (7) such that the first surface (3) faces the protective substrate, the wafer comprising a substrate of a first material (8) with an optical transparent layer (9) and a layer of semiconductor material (10), wherein the substrate (8) is selectively removed from the layer of semiconductor material by using the optical transparent layer (9) as stopping layer. For back-side illuminated image sensors, light has to transmit through the semiconductor layer and enter into the light sensitive pixel regions (5). In order to reduce absorption losses, it is very advantageous that the semiconductor layer (10) can be made relatively thin with a good uniformity.

Abstract: A socket (1) for accommodating and testing a component (2) having several electrical connectors (3) is disclosed, which socket comprises a substantially rectangular frame (4) surrounding a space (5), which frame (4) includes a first row (6) and a second row (7) of electric conductors (8) which are arranged opposite one another, which conductors (8) have first section (9) with a terminal (10) extending into space (5) for contacting an electric connector (3) of the component (2), and a second section (11) projecting from the frame (4). The spacing (12) between the terminals (10) in each row (6, 7) is adjustable. In the method of testing a component (2) in the socket (1), the spacing (12) between the terminals (10) in each row (6, 7) is adjusted to establish electrical contact between the electrical connectors (3) of the component (2) and its corresponding terminal (10) by placing the component (2) in the socket (1).

Abstract: A socket (1) for accommodating and testing a component (2) having several electrical connectors (3) is disclosed, which socket comprises a substantially rectangular frame (4) surrounding a space (5), which frame (4) includes a first row (6) and a second row (7) of electric conductors (8) which are arranged opposite one another, which conductors (8) have a first section (9) with a terminal (10) extending into space (5) for contacting an electric connector (3) of the component (2), and a second section (11) projecting from the frame (4). The spacing (12) between the terminals (10) in each row (6, 7) is adjustable. In the method of testing a component (2) in the socket (1), the spacing (12) between the terminals (10) in each row (6, 7) is adjusted to establish electrical contact between the electrical connectors (3) of the component (2) and its corresponding terminal (10) by placing the component (2) in the socket (1).