Patents by Inventor Erik Jung

Erik Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12029789
    Abstract: The present invention relates to agents for use in the treatment of glioma, in particular astrocytoma WHO II° and III°, as well as IV° (glioblastoma), in a subject.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: July 9, 2024
    Assignee: Universität Heidelberg
    Inventors: Matthias Osswald, Wolfgang Wick, Frank Winkler, Erik Jung, Jonas Blaes
  • Publication number: 20230322776
    Abstract: The invention relates to a compound of formula (I) or a pharmaceutically acceptable salt thereof, wherein n, R1, R2, R3, R4 and R5 are as defined in the description and in the claims. The compound of formula (I) can be used as a medicament.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 12, 2023
    Applicant: Hoffmann-La Roche Inc.
    Inventors: Cosimo Dolente, David Stephen Hewings, Daniel Hunziker, Erik Jung, Piergiorgio Francesco Tommaso Pettazzoni, Fabienne Ricklin, Claus Riemer, Juergen Wichmann
  • Publication number: 20220360703
    Abstract: An imaging system includes an imaging device having a holder configured to hold a cell culture plate with a plurality of wells. The imaging device also includes an imaging assembly having a plurality of imaging units, each of which is configured to image one well of the plurality of wells. The imaging system also includes a storage platform in communication with the imaging device configured to receive a plurality of images from the imaging device. The system further includes a computer in communication with the imaging device and the storage platform. The computer is configured to control the imaging device and to display at least one image of the plurality of images.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 10, 2022
    Inventors: Victoria Ly, Pierre Baudin, Pat Pansodtee, Erik Jung, Robert Currie, David Haussler, Mircea Teodorescu
  • Publication number: 20220202936
    Abstract: The present invention relates to agents for use in the treatment of glioma, in particular astrocytoma WHO II° and III°, as well as IV° (glioblastoma), in a subject.
    Type: Application
    Filed: January 5, 2022
    Publication date: June 30, 2022
    Applicant: DC EUROPA LIMITED
    Inventors: Matthias Osswald, Wolfgang Wick, Frank Winkler, Erik Jung, Jonas Blaes
  • Patent number: 11246927
    Abstract: The present invention relates to agents for use in the treatment of glioma, in particular astrocytoma WHO I? and 111°, as well as IV0 (glioblastoma), in a subject.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 15, 2022
    Assignee: DC EUROPA LIMITED
    Inventors: Matthias Osswald, Wolfgang Wick, Frank Winkler, Erik Jung, Jonas Blaes
  • Publication number: 20180221479
    Abstract: The present invention relates to agents for use in the treatment of glioma, in particular astrocytoma WHO IF and 111°, as well as IV0 (glioblastoma), in a subject.
    Type: Application
    Filed: July 6, 2016
    Publication date: August 9, 2018
    Inventors: Matthias Osswald, Wolfgang Wick, Frank Winkler, Erik Jung, Jonas Blaes
  • Publication number: 20110192445
    Abstract: A method for fabricating a photoelectric array device with an optical micro lens array (10) using a plurality of photovoltaic dies (12) so a lens (14) is aligned to each die (12) in the array device. A back surface (16) of a lens array substrate (10) is metallized with electrical conducting lines and interconnects (18). Fabricated photovoltaic dies are aligned to an alignment substrate using a fluidic capillary-driven alignment process. The plurality of aligned dies (12) is attached mechanically and electrically to the metallized lens array substrate (10), so the each die (12) aligns with a lens (14) in the lens array substrate (10). The alignment substrate is removed from the dies (12) attached to the lens array substrate (10). A back panel substrate (22) is coupled mechanically and electrically to the plurality of dies (12) attached to the lens array substrate (10).
    Type: Application
    Filed: March 13, 2009
    Publication date: August 11, 2011
    Inventors: Florian Solzbacher, Erik Jung
  • Patent number: 7911051
    Abstract: An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: March 22, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Robert Ingenbleek, Erik Jung, Alfred Kolb, Andreas Rekofsky, Roland Schöllhorn, Daniela Wolf
  • Publication number: 20090161319
    Abstract: An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is associated with a considerably increased heat dissipation capability for the relevant component and, in addition, also affords further advantages in connection with changes in the population and/or line routing which might occur in practice. The important factor for this is that the component is arranged under a second circuit carrier which is held in a recess in the first circuit carrier. The recess passes through to the top side of the heat sink.
    Type: Application
    Filed: October 5, 2006
    Publication date: June 25, 2009
    Applicants: CONTINENTAL AUTOMOTIVE GMBH, ZF FRIEDRICHSHAFEN AG
    Inventors: Robert Ingenbleek, Erik Jung, Alfred Kolb, Andreas Rekofsky, Roland Schollhorn, Daniela Wolf
  • Patent number: 7011989
    Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: March 14, 2006
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Karl-Friedrich Becker, Tanja Braun, Mathias Koch, Andreas Ostmann, Lars Böttcher, Erik Jung
  • Publication number: 20040110323
    Abstract: A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.
    Type: Application
    Filed: October 30, 2003
    Publication date: June 10, 2004
    Inventors: Karl-Friedrich Becker, Tanja Braun, Mathias Koch, Andreas Ostmann, Lars Bottcher, Erik Jung
  • Patent number: 6409073
    Abstract: A substrate (10, 80) includes a conductive layer (16, 82) which is non-wettable by solder. A solder receiving stud (22, 84) is formed on the conductive layer, preferably by plating. If used for transferring solder, a solder bump (32) is selectively formed on the solder receiving stud since the surrounding conductive layer is not wettable by the solder. A receiving substrate, such as a semiconductor device (100), is aligned with the substrate. The solder bump is heated to a liquidus state and the solder bump makes physical contact with a solder accepting stud (120) of the receiving substrate. Because the area of the solder accepting stud is larger than the area of the corresponding stud on the transfer substrate, the majority of the solder will transfer to the receiving substrate upon separation. Alternatively, the device could itself already have bumps formed thereon, in which case an unbumped substrate is used to test the device, and solder remains on the device upon separation.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: June 25, 2002
    Assignee: Fraunhofer-Gesellschaft Zur Foerderung der Angewandten Forschung E.V.
    Inventors: Kenneth Kaskoun, Erik Jung, Werner Budweiser