Patents by Inventor Erik L. Turner

Erik L. Turner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming copper alloy sputtering targets with refined shape and microstructure
    Patent number: 11035036
    Abstract: A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: June 15, 2021
    Assignee: Honeywell International Inc.
    Inventors: Stephane Ferrasse, Frank C. Alford, Ira G. Nolander, Erik L. Turner, Patrick Underwood
  • High quality, void and inclusion free alloy wire
    Patent number: 10421161
    Abstract: Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: September 24, 2019
    Assignee: Honeywell International Inc.
    Inventors: Younes Sina, David E. Steele, Ira G. Nolander, Erik L. Turner
  • METHOD OF FORMING COPPER ALLOY SPUTTERING TARGETS WITH REFINED SHAPE AND MICROSTRUCTURE
    Publication number: 20190233935
    Abstract: A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.
    Type: Application
    Filed: January 14, 2019
    Publication date: August 1, 2019
    Inventors: Stephane Ferrasse, Frank C. Alford, Ira G. Nolander, Erik L. Turner, Patrick Underwood
  • HIGH QUALITY, VOID AND INCLUSION FREE ALLOY WIRE
    Publication number: 20170320172
    Abstract: Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.
    Type: Application
    Filed: April 24, 2017
    Publication date: November 9, 2017
    Inventors: Younes Sina, David E. Steele, Ira G. Nolander, Erik L. Turner